APA600-FG256A

The APA600-FG256A is a ProASICPLUS flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a mid-range logic fabric with 21,504 logic elements and approximately 0.129 Mbits of embedded RAM in a compact 256-LBGA package.

Designed and qualified for automotive use, the device delivers 186 user I/Os, an operating temperature range of −40 °C to 125 °C, and a nominal supply voltage window of 2.375 V to 2.625 V—making it suitable for automotive and other temperature-demanding embedded applications requiring on-chip logic and memory integration.

Key Features

• Logic Capacity 21,504 logic elements providing about 600,000 gates for implementing mid-density digital functions and custom logic.
• Embedded Memory Approximately 0.129 Mbits (129,024 bits) of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Density 186 user I/Os for flexible interfacing to sensors, actuators, peripherals, and external logic.
• Voltage Supply Operates from 2.375 V to 2.625 V to match specific system power rails.
• Automotive Qualification AEC-Q100 qualification and an operating range of −40 °C to 125 °C for temperature-critical automotive deployments.
• Package and Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Automotive control modules — Suitable for body, gateway, and control applications where AEC-Q100 qualification and wide temperature range are required.
• Sensor and actuator interfaces — 186 I/Os and on-chip memory support aggregation, conditioning, and local processing of signals in embedded systems.
• Custom logic and state machines — Mid-range logic capacity enables implementation of protocol handling, timing-critical logic, and glue functions.
• Compact embedded platforms — 256-LBGA surface-mount packaging fits space-constrained designs that need integrated logic and memory.

Unique Advantages

• Automotive-ready qualification: AEC-Q100 certification combined with −40 °C to 125 °C operation addresses temperature and reliability needs for automotive designs.
• Substantial mid-range logic: 21,504 logic elements and roughly 600,000 gates provide the capacity to consolidate multiple discrete functions into a single device.
• Ample I/O for system integration: 186 user I/Os simplify board-level routing and reduce the need for external interface components.
• On-chip RAM for local data handling: Approximately 0.129 Mbits of embedded memory supports buffering and temporary storage without external memory.
• Compact, board-level friendly package: 256-LBGA (256-FPBGA, 17×17) surface-mount package enables high-density placement and reliable soldering processes.
• Standards-conscious procurement: RoHS compliance assists in meeting environmental manufacturing requirements.

Why Choose APA600-FG256A?

The APA600-FG256A balances mid-range logic capacity, a generous I/O count, and onboard RAM within an automotive-qualified package, making it well suited for embedded designs that require robust operation across a wide temperature range. Its qualification to AEC-Q100 and the specified supply and temperature ranges provide predictable behavior in demanding environments.

Manufactured by Microchip Technology, this ProASICPLUS device is a practical choice for engineers looking to consolidate functions, reduce BOM complexity, and deploy FPGA-based logic in automotive or temperature-sensitive embedded systems where surface-mount 256-LBGA packaging is preferred.

Request a quote or contact sales to discuss pricing, availability, and how the APA600-FG256A fits your next design.