APA600-CGS624M

The APA600-CGS624M is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology, offering 21,504 logic elements and 440 user I/O in a 624-ball BCCGA package. It provides on-chip embedded memory and a gate density suitable for complex, I/O‑rich designs that require military-grade qualification.

Designed and qualified to MIL-STD-883 with an operating range of −55 °C to 125 °C and a nominal supply of 2.3–2.7 V, this device targets applications that demand wide temperature capability and formal military qualification.

Key Features

• Core Logic  21,504 logic elements (cells) enabling implementation of substantial custom logic and glue functions.
• On‑Chip Memory  Approximately 0.13 Mbits of embedded RAM (129,024 total RAM bits) for buffering, lookup tables, and small data storage.
• I/O Capability  440 user I/O pins to support high‑pin‑count interfaces and dense system integration.
• Gate Density  600,000 gates for combined logic and system control functions within a single device.
• Package & Mounting  624‑BCCGA package (supplier package: 624‑CCGA, 32.5×32.5 mm) with through‑hole mounting for robust PCB attachment options.
• Power  Operates from a 2.3 V to 2.7 V supply, enabling integration into regulated low‑voltage system rails.
• Temperature & Qualification  Military grade, qualified to MIL‑STD‑883 and specified for −55 °C to 125 °C operation.
• Regulatory  RoHS compliant.

Typical Applications

• Military & Defense Systems  Use in mission equipment and subsystems where MIL‑STD‑883 qualification and extended temperature range are required.
• High‑Reliability Embedded Systems  Custom logic, protocol bridging, and I/O aggregation in systems demanding wide temperature and formal qualification.
• I/O‑Intensive Designs  Applications requiring large numbers of external signals or interfaces leverage the device’s 440 I/O pins.

Unique Advantages

• Military Qualification: MIL‑STD‑883 qualification and a −55 °C to 125 °C rating support deployment in temperature‑extreme, high‑reliability environments.
• High I/O Count: 440 user I/Os reduce the need for external I/O expanders and simplify board-level connectivity.
• Substantial Logic Resources: 21,504 logic elements and ~600,000 gates enable consolidation of multiple functions into a single FPGA, lowering BOM complexity.
• On‑Chip Memory: Approximately 0.13 Mbits of embedded RAM supports buffering and small data‑storage tasks without external memory.
• Robust Packaging & Mounting: 624‑BCCGA in a 32.5×32.5 mm supplier package with through‑hole mounting options for durable PCB assembly.
• Low‑Voltage Operation: 2.3–2.7 V supply compatibility with modern system rails simplifies power distribution.

Why Choose APA600-CGS624M?

The APA600-CGS624M delivers a balanced combination of high I/O density, significant logic capacity, and embedded RAM in a MIL‑STD‑883 qualified ProASICPLUS FPGA. Its extended temperature rating and military grade make it suitable for designs where formal qualification and thermal robustness are essential.

This device is appropriate for engineers and procurement teams specifying solutions for high‑reliability embedded systems, defense platforms, and other applications that require a qualified, I/O‑rich FPGA from Microchip Technology.

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