APA600-CQ208M

The APA600-CQ208M is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology, offered in a 208‑lead BFCQFP package with tie bar. It provides a balance of logic capacity, embedded memory and I/O density in a surface-mount package qualified for military use.

With 21,504 logic elements, approximately 0.13 Mbits of embedded memory and 158 I/Os, this device targets designs that require significant on-chip logic and I/O integration while meeting MIL‑STD‑883 qualification and an extended temperature range.

Key Features

• Core Logic  21,504 logic elements (cells) providing the programmable fabric for custom digital designs.
• Embedded Memory  Approximately 0.13 Mbits of on-chip RAM (129,024 total RAM bits) for buffering, state storage and small data structures.
• I/O Capability  158 user I/Os to support dense interfacing, peripheral control and multiple signal domains.
• Gate Count  600,000 gates of programmable logic capacity for complex combinational and sequential logic implementations.
• Power  Single supply operation from 2.3 V to 2.7 V, enabling integration into low-voltage systems.
• Package & Mounting  208‑BFCQFP with tie bar (supplier package 208‑CQFP, 75 × 75) in a surface‑mount form factor suitable for board-level assembly.
• Qualification & Grade  Military grade with MIL‑STD‑883 qualification for applications requiring proven reliability and screening.
• Operating Range  Rated for operation from −55 °C to 125 °C to address wide temperature environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Military and Aerospace Systems  Qualified to MIL‑STD‑883 and rated for −55 °C to 125 °C, suitable for rugged, mission‑critical electronic modules.
• Rugged Embedded Controllers  High logic density and substantial I/O enable custom control, protocol handling and interface aggregation in harsh environments.
• High‑Density I/O and Interface Bridging  158 I/Os support complex board‑level interfacing, signal routing and protocol translation tasks.
• Custom Logic and Signal Processing  600,000 gates and 21,504 logic elements provide resources for application‑specific accelerators and real‑time logic functions.

Unique Advantages

• Military‑grade qualification: MIL‑STD‑883 qualification and "Military" grade designation provide traceable screening and reliability for defense applications.
• Broad operating temperature: Rated from −55 °C to 125 °C to maintain functionality across extreme thermal environments.
• Substantial on‑chip resources: 21,504 logic elements and approximately 0.13 Mbits of embedded memory enable compact, integrated implementations that reduce external component count.
• High I/O count: 158 user I/Os facilitate dense system connectivity and flexible board‑level partitioning.
• Compact, surface‑mount packaging: 208‑lead BFCQFP (208‑CQFP, 75 × 75) supports conventional PCB assembly while preserving pin density.
• Low‑voltage operation: 2.3 V to 2.7 V supply range allows use in low‑voltage system designs.

Why Choose APA600-CQ208M?

The APA600-CQ208M positions itself as a robust, MIL‑qualified FPGA option for designs that require a combination of significant logic capacity, ample I/O and extended temperature operation. Its qualification to MIL‑STD‑883 and surface‑mount 208‑lead package make it suitable for rugged embedded applications where reliability and screened components are required.

Backed by Microchip Technology, this ProASICPLUS device is appropriate for engineering teams seeking a military‑grade programmable solution that consolidates logic, memory and I/O to simplify board design and reduce external components.

Request a quote or contact sales to discuss availability, pricing and how the APA600-CQ208M can meet your military and rugged embedded design requirements.