APA600-FGG256M

The APA600-FGG256M is a ProASICPLUS field programmable gate array (FPGA) offered in a 256-LBGA package. It provides a mid-density programmable fabric with 21,504 logic elements, 600,000 gates and approximately 0.13 Mbits of embedded memory, suitable for military-grade embedded applications.

Qualified to MIL-STD-883 and specified for operation from -55°C to 125°C with a 2.3 V–2.7 V supply, this surface-mount FPGA targets designs that require reliability across extreme environments while delivering substantial I/O and logic capacity.

Key Features

• Logic Capacity  21,504 logic elements (cells) and 600,000 gates provide mid-density programmable logic for combinational and sequential designs.
• On-chip Memory  Approximately 0.13 Mbits (129,024 bits) of embedded RAM to support buffering, state storage and small data tables.
• I/O  186 user I/O pins to interface with peripherals, sensors and external logic.
• Power Supply  Operates from 2.3 V to 2.7 V, enabling integration into low-voltage systems.
• Package & Mounting  Supplied in a 256-LBGA (supplier package: 256-FPBGA, 17×17) surface-mount package for compact board implementations.
• Qualification & Grade  Military-grade device qualified to MIL-STD-883 for applications requiring recognized military-level screening.
• Temperature Range  Rated for operation from -55°C to 125°C to meet demanding thermal environments.
• Regulatory  RoHS compliant.

Typical Applications

• Aerospace & Defense  Use as programmable logic in avionics, communications and mission systems where MIL-STD-883 qualification and wide temperature range are required.
• Rugged Embedded Systems  Integration into ruggedized controllers and sensor interfaces that demand reliable operation from -55°C to 125°C.
• Secure & Hardened Electronics  Deployment in secure processing or control nodes requiring military-grade components and extensive I/O.

Unique Advantages

• Military-qualified component: MIL-STD-883 qualification and a -55°C to 125°C operating range support high-reliability applications in harsh environments.
• Substantial logic resources: 21,504 logic elements and 600,000 gates enable integration of complex logic functions without external ASICs.
• Significant I/O count: 186 I/O pins provide flexible interfacing to sensors, transceivers and peripheral devices.
• Compact LBGA packaging: 256-LBGA (256-FPBGA, 17×17) surface-mount package saves board space while delivering robust connectivity.
• Low-voltage operation: 2.3 V–2.7 V supply range suits modern low-voltage system architectures.
• On-chip embedded memory: 129,024 bits of RAM support local buffering and state retention to simplify system design.

Why Choose APA600-FGG256M?

The APA600-FGG256M positions itself as a reliable, mid-density FPGA choice for designs that require military-grade qualification, wide temperature operation and a balance of logic capacity and I/O. Its combination of 21,504 logic elements, 186 I/O and embedded RAM makes it appropriate for embedded defense, aerospace and other high-reliability systems.

For projects that prioritize robustness and long-term field performance, this ProASICPLUS device delivers a compact, qualified programmable solution that integrates significant logic and memory capacity within a 256-LBGA surface-mount package.

Request a quote or submit an inquiry to receive pricing and availability for the APA600-FGG256M. Our team can provide the procurement details you need to move your design forward.