APA600-FGG676I

The APA600-FGG676I is a ProASICPLUS field programmable gate array designed for industrial applications. It provides a dense logic fabric with 21,504 logic elements and on-chip memory for compact, reconfigurable hardware implementation.

With 454 I/Os, support for a 2.3 V to 2.7 V supply range, a 676-FBGA (27×27) package, and an operating temperature range of −40 °C to 85 °C, this device targets designs requiring a combination of high I/O count, moderate embedded memory, and industrial-grade environmental capability.

Key Features

• Logic Capacity — 21,504 logic elements (LEs) provide a flexible resource pool for implementing combinational and sequential logic in compact systems.
• Embedded Memory — Approximately 0.129 Mbits of on-chip RAM (129,024 total RAM bits) for buffering, FIFOs, and small data tables without external memory.
• I/O — 454 programmable I/Os to support dense connectivity with external peripherals, sensors, and interfaces.
• Gate Count — 600,000 gates for mapping complex logic functions and control paths.
• Power Supply — Operates from a 2.3 V to 2.7 V supply, suitable for designs using this voltage domain.
• Package and Mounting — 676-FBGA (27×27) package, surface-mount mounting for compact PCB integration.
• Industrial Temperature Grade — Rated for −40 °C to 85 °C operation to meet industrial environmental requirements.
• RoHS Compliance — Device is RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Industrial Control — Industrial-grade temperature rating and high I/O count make the device suitable for control logic, I/O aggregation, and deterministic processing in factory automation.
• Communications and Networking — Large I/O complement and substantial gate/logic resources support protocol handling, interface translation, and custom packet processing.
• Instrumentation and Test Equipment — On-chip RAM and abundant logic elements enable custom signal processing, data buffering, and control functions in measurement systems.

Unique Advantages

• Dense Logic Integration: 21,504 logic elements and 600,000 gates allow substantial digital functionality on a single device, reducing board-level component count.
• High Pin Count: 454 I/Os provide flexibility for complex peripheral interfacing without additional I/O expanders.
• Compact Package: 676-FBGA (27×27) surface-mount package enables high-density PCB layouts while preserving routing and signal integrity options.
• Embedded Memory: Approximately 0.129 Mbits of on-chip RAM reduces dependence on external memory for small buffers and control tables.
• Industrial Reliability: −40 °C to 85 °C operating range and RoHS compliance support deployment in industrial environments and lead-free manufacturing.

Why Choose APA600-FGG676I?

The APA600-FGG676I combines a large logic fabric, substantial I/O capacity, and embedded memory in a compact 676-FBGA package, making it well suited to industrial designs that require reconfigurable logic and dense connectivity. Its voltage and temperature specifications align with industrial system requirements, offering a straightforward integration path for engineers working on control, communications, and instrumentation projects.

This device is appropriate for teams seeking a scalable FPGA solution that balances logic capacity, I/O count, and environmental robustness while maintaining a compact board footprint and RoHS-compliant manufacturing readiness.

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