APA600-PQ208M

IC FPGA 158 I/O 208QFP
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 129024 208-BFQFP

Quantity 839 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case208-BFQFPNumber of I/O158Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21504Number of Logic Elements/Cells21504
Number of Gates600000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits129024

Overview of APA600-PQ208M – ProASICPLUS FPGA, 600,000 Gates, 158 I/O, Military Grade

The APA600-PQ208M is a ProASICPLUS field-programmable gate array (FPGA) IC from Microchip Technology delivered in a 208-BFQFP package. It provides a fixed hardware fabric with substantial logic and I/O resources intended for applications requiring deterministic, reconfigurable logic.

Key on-chip resources include 21,504 logic elements, approximately 0.129 Mbits of embedded memory (129,024 total RAM bits), and 600,000 gates, paired with 158 I/O pins. The device is qualified to MIL-STD-883, RoHS compliant, rated for operation from −55 °C to 125 °C, and operates from a 2.3 V to 2.7 V supply.

Key Features

  • Core Logic  21,504 logic elements and 600,000 gates provide programmable fabric for custom logic and control functions.
  • Embedded Memory  Approximately 0.129 Mbits of on-chip RAM (129,024 bits) for buffering, state storage, and small data structures.
  • I/O Density & Package  158 I/O pins in a 208-BFQFP package; supplier device package listed as 208-PQFP (28×28) for compact PCB implementations.
  • Power  Low-voltage operation from 2.3 V to 2.7 V to match systems using similar supply rails.
  • Temperature Range  Operational rating from −55 °C to 125 °C for deployment in wide-temperature and harsh environments.
  • Qualification & Reliability  Military grade with MIL-STD-883 qualification for applications requiring ruggedized component qualification.
  • Mounting & Compliance  Surface-mount device construction and RoHS compliance for modern assembly and environmental requirements.

Typical Applications

  • Defense and Military Systems  MIL-STD-883 qualification and wide temperature range make the APA600-PQ208M suited for deployed military electronics and ruggedized control systems.
  • Aerospace Electronics  High gate count and logic elements with extended temperature capability support embedded processing, avionics control, and mission-critical interfaces.
  • Rugged Embedded Control  Use the device for custom motor control, deterministic state machines, and embedded controllers where predictable logic resources and I/O are required.
  • Sensor Interfacing and Data Aggregation  On-chip RAM and plentiful I/O support buffering, preprocessing, and aggregation of sensor data in constrained systems.

Unique Advantages

  • Military-Qualified Reliability:  MIL-STD-883 qualification and a −55 °C to 125 °C rating support designs that require proven component-level robustness.
  • Significant Logic Capacity:  21,504 logic elements and 600,000 gates enable substantial custom logic integration without external ASICs or CPLDs.
  • Compact, High-I/O Package:  158 I/O in a 208-BFQFP footprint offers dense connectivity for mixed-signal and multi-interface designs while minimizing board area.
  • Low-Voltage Operation:  2.3 V to 2.7 V supply support allows integration into systems with lower-voltage power domains.
  • RoHS Compliant:  Meets environmental compliance needs for modern assemblies and procurement requirements.

Why Choose APA600-PQ208M?

The APA600-PQ208M positions itself as a military-grade, mid-to-large capacity FPGA offering a clear set of on-chip resources—logic elements, gates, embedded RAM and I/O—paired with MIL-STD-883 qualification and a wide operating temperature range. It is suited to engineers and procurement teams designing rugged embedded systems that require predictable, reconfigurable logic in a compact, surface-mount package.

For programs that prioritize component qualification, thermal resilience and defined resource availability, the APA600-PQ208M delivers a balance of integration and reliability backed by Microchip Technology’s device family heritage.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the APA600-PQ208M.

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