APA600-PQG208A

The APA600-PQG208A is a ProASICPLUS flash-based FPGA from Microchip Technology. It provides 21,504 logic elements and approximately 0.129 Mbits of embedded memory in a surface-mount 208-BFQFP package.

With 158 user I/Os, support for a 2.375 V to 2.625 V supply range, and AEC-Q100 qualification, this device is specified for demanding environments and applications that require on-chip logic density, I/O capacity, and automotive-grade qualification.

Key Features

• Core Logic 21,504 logic elements (cells) supporting up to 600,000 gates for implementing complex programmable logic and state machines.
• Embedded Memory Total on-chip RAM of 129,024 bits (approximately 0.129 Mbits) to store configuration data, FIFOs, and small buffers directly in the FPGA fabric.
• High I/O Count 158 general-purpose I/O pins to support dense sensor, peripheral, and bus interfacing without external I/O expanders.
• Package and Mounting 208-BFQFP surface-mount package; supplier device package listed as 208-PQFP (28×28) for board-level planning and layout.
• Power Single-supply operation with a specified voltage range of 2.375 V to 2.625 V to match targeted system power rails.
• Automotive Qualification AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C, suitable for temperature-demanding applications.
• Regulatory RoHS compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

• Automotive Electronics AEC-Q100 qualification and −40 °C to 125 °C rating enable use in in-vehicle systems requiring qualified programmable logic.
• I/O-Intensive Modules The 158 I/Os support modules that require multiple peripheral interfaces or signal aggregation points on a single device.
• Memory-Dependent Logic Approximately 0.129 Mbits of embedded RAM provides on-chip storage for small buffers, lookup tables, and queueing logic.

Unique Advantages

• High Logic Density: 21,504 logic elements and up to 600,000 gates allow consolidation of multiple discrete functions into a single FPGA, reducing board-level component count.
• Automotive-Grade Qualification: AEC-Q100 qualification and wide operating temperature range provide design assurance for automotive and harsh-environment deployments.
• Generous I/O Provisioning: 158 user I/Os simplify interfacing to sensors, actuators, and peripherals without additional interface components.
• Compact Surface-Mount Packaging: 208-BFQFP (208-PQFP, 28×28) packaging delivers a balance of pin count and board footprint for space-constrained designs.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose APA600-PQG208A?

The APA600-PQG208A positions itself as a robust, automotive-qualified FPGA option for designs that need substantial on-chip logic, ample I/O, and embedded memory within a compact surface-mount package. Its combination of logic density, I/O count, and AEC-Q100 qualification makes it suitable for applications where long-term reliability and temperature tolerance are required.

This device is a practical choice for engineers and procurement teams looking to consolidate functions, simplify BOMs, and leverage a qualified FPGA from Microchip Technology while maintaining clear electrical and thermal operating parameters.

Request a quote or submit an inquiry to obtain pricing and availability for APA600-PQG208A to support your next design.