APA750-BG456I

The APA750-BG456I is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology. It provides mid-range logic capacity with a high I/O count and embedded RAM in a compact ball-grid array package suitable for surface-mount assembly.

Designed for industrial applications, the device combines approximately 32,768 logic elements, roughly 147,456 bits of on-chip RAM, and 356 user I/O pins while operating over a 2.3 V to 2.7 V supply range and a −40 °C to 85 °C temperature window.

Key Features

• Core / Logic  Approximately 32,768 logic elements and about 750,000 gates provide mid-range programmable logic capacity for complex glue logic, state machines, and control functions.
• Embedded Memory  Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) to support buffering, FIFOs, and small data tables.
• I/O  356 user I/O pins enable extensive peripheral and bus interfacing without external multiplexers.
• Power  Operates from a 2.3 V to 2.7 V supply range for compatibility with common core power rails.
• Package & Mounting  456-ball BBGA package (supplier device package: 456-PBGA, 35 × 35 mm) in a surface-mount form factor for high-density board designs.
• Temperature & Grade  Industrial-grade device with an operating temperature range from −40 °C to 85 °C.
• Environmental Compliance  RoHS-compliant construction for regulatory and manufacturing requirements.

Typical Applications

• Industrial Control  Use in factory automation and PLC subsystems where industrial temperature operation and a high I/O count are required for sensor, actuator, and fieldbus interfaces.
• Embedded Systems  Integration of custom logic, protocol bridging, and peripheral management in compact embedded platforms that benefit from on-chip RAM and abundant I/O.
• Communications Equipment  Implementation of interface logic, packet buffering, and protocol handling leveraging the device’s I/O density and embedded memory.
• Instrumentation and Test  Custom signal routing, timing control, and data capture functions for measurement and test equipment that operate across industrial temperatures.

Unique Advantages

• High Logic Density:  Approximately 32,768 logic elements provide substantial programmable resources for consolidating multiple discrete functions into a single device.
• Large I/O Count:  356 I/Os reduce external components and PCB complexity for systems that require extensive peripheral or bus connections.
• Embedded RAM for Data Handling:  About 147,456 bits of on-chip RAM support local buffering and low-latency data paths without relying on external memory.
• Industrial Temperature Capability:  Rated from −40 °C to 85 °C to meet environmental demands common in industrial deployments.
• Compact, Surface-Mount BBGA Package:  456-ball BBGA (35 × 35 mm) enables high-density PCB layouts while maintaining robust soldered connections.
• Regulatory Compliance:  RoHS-compliant manufacturing supports environmental and assembly requirements.

Why Choose APA750-BG456I?

The APA750-BG456I positions itself as a practical choice for designers who need a balance of programmable logic capacity, significant I/O density, and embedded memory in an industrial-grade package. Its supply voltage range and temperature rating make it appropriate for systems that operate in demanding environments while keeping board-level component counts low.

This device is well suited for engineers developing industrial control, embedded processing, and communications interface solutions that require reliable, mid-range FPGA resources in a compact surface-mount BBGA form factor.

Request a quote or submit an inquiry for pricing and availability of the APA750-BG456I to begin integrating this ProASICPLUS FPGA into your next design.