APA750-BGG456I

The APA750-BGG456I is a field programmable gate array (FPGA) IC from Microchip Technology's ProASICPLUS family, offering a balanced combination of logic capacity, on-chip memory, and a high I/O count in a compact ball-grid package. Designed for industrial applications, the device provides 32,768 logic elements and 356 I/O to support complex control, interface, and signal-handling tasks.

With a supply range of 2.3 V to 2.7 V and an operating temperature range of -40 °C to 85 °C, this surface-mount FPGA is suited to robust embedded designs that require moderate embedded memory and substantial I/O in a 456-ball BGA footprint.

Key Features

• Core Logic  32,768 logic elements and approximately 750,000 gates provide the programmable fabric for implementing custom digital logic, state machines, and glue logic.
• Embedded Memory  Approximately 0.15 Mbits of on-chip RAM (147,456 bits) for buffering, FIFOs, and small data structures.
• I/O Density  356 user I/O pins enable complex interfacing and parallel connectivity for multi-channel systems and high-pin-count peripherals.
• Power  Operates from a 2.3 V to 2.7 V supply range to match low-voltage system rails.
• Package and Mounting  Surface-mount 456-BBGA package (supplier device package: 456-PBGA, 35×35 mm) for compact, high-density PCB layouts.
• Industrial Temperature and Reliability  Rated for -40 °C to 85 °C operation and listed as Industrial grade; RoHS compliant for regulatory alignment.

Typical Applications

• Industrial Control: Use the device’s industrial temperature range and high I/O count for machine control, PLC interfacing, and factory automation functions.
• High-density I/O Interfaces: Leverage 356 I/O pins and abundant logic elements to implement protocol bridging, I/O expansion, and custom bus interfaces.
• Embedded System Glue Logic: Implement custom control paths, state machines, and peripheral arbitration where compact packaging and moderate embedded RAM are required.

Unique Advantages

• High integration in a compact package: 32,768 logic elements and 356 I/O in a 456-ball BGA provide substantial functionality while minimizing PCB footprint.
• Balanced on-chip memory: Approximately 0.15 Mbits of embedded RAM supports buffering and local storage without external memory in many control and interface applications.
• Low-voltage operation: 2.3 V to 2.7 V supply compatibility simplifies integration with low-voltage system rails.
• Industrial temperature rating: -40 °C to 85 °C operation meets the thermal requirements of many industrial deployments.
• RoHS compliant: Conforms to RoHS requirements, aiding regulatory compliance for commercial products.

Why Choose APA750-BGG456I?

The APA750-BGG456I positions itself as a reliable, mid-density ProASICPLUS FPGA option for designers who need a balance of logic capacity, I/O density, and on-chip memory in an industrial-capable package. Its combination of 32,768 logic elements, 356 I/O, and a compact 456-BBGA footprint delivers flexibility for embedded control, interface, and signal-processing roles.

Backed by Microchip Technology and offered in a surface-mount, RoHS-compliant package with a wide operating temperature range, this FPGA is suited to engineers seeking a durable, scalable building block for long-lived industrial and embedded designs.

Request a quote or submit a quote today to obtain pricing and availability for the APA750-BGG456I.