APA750-BG456

The APA750-BG456 is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a commercial-grade programmable-logic solution with a balance of logic density, on-chip memory and a high I/O count in a compact BGA package.

Targeted at commercial applications, this surface-mount device integrates 32,768 logic elements and abundant I/O to support a range of embedded logic and system-integration tasks within a 456-BBGA (456-PBGA, 35×35 mm) footprint.

Key Features

• Core — Logic Elements & Gate Capacity Provides 32,768 logic elements and 750,000 gates for implementing complex combinational and sequential logic.
• Embedded Memory Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for buffering, FIFOs and temporary storage.
• I/O and Package 356 general-purpose I/O pins in a 456-BBGA package; supplier device package listed as 456-PBGA (35×35 mm). Surface-mount mounting type supports compact board layouts.
• Power Operates from a 2.3 V to 2.7 V supply range to match low-voltage system domains.
• Temperature & Grade Commercial-grade device with an operating temperature range of 0 °C to 70 °C.
• Environmental Compliance RoHS-compliant construction.

Typical Applications

• Commercial embedded systems — Implement custom logic and glue functions in commercial electronic products that require programmable logic with defined operating-temperature limits.
• High-density I/O interfaces — Use where a large number of parallel or multiplexed I/Os are needed; 356 I/O pins enable complex peripheral and bus connections.
• Compact system integration — 456-BBGA (35×35 mm) surface-mount package supports dense PCB layouts and space-constrained designs.

Unique Advantages

• High logic capacity: 32,768 logic elements and 750,000 gates accommodate substantial logic integration without external CPLDs.
• On-chip memory: Approximately 0.147 Mbits of embedded RAM for local buffering and state storage, reducing external memory needs.
• Extensive I/O: 356 I/O pins provide broad interfacing options for sensors, peripherals and parallel buses.
• Compact BGA footprint: 456-BBGA / 456-PBGA (35×35 mm) package enables high-density board designs while maintaining solderable surface-mount assembly.
• Low-voltage operation: 2.3 V–2.7 V supply compatibility for integration into low-voltage domains.
• Regulatory compliance: RoHS-compliant construction supports regulatory requirements for lead-free assembly.

Why Choose APA750-BG456?

The APA750-BG456 positions itself as a commercial-grade ProASICPLUS FPGA that combines a substantial logic element count, on-chip memory and a high I/O tally in a compact surface-mount BGA package. Its electrical and thermal limits (2.3 V–2.7 V supply, 0 °C to 70 °C operating range) make it a clear choice for designers building commercial electronic products that require configurable logic and dense I/O.

Manufactured by Microchip Technology, this device is suitable for design teams that need a straightforward programmable-logic component with defined specifications for logic capacity, memory and packaging within a commercial temperature profile.

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