APA600-PQG208I

The APA600-PQG208I is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology. It delivers a mid-density programmable logic solution with 21,504 logic elements and approximately 600,000 gates to implement custom digital functions.

Designed for industrial applications, the device provides 158 I/O pins, roughly 0.129 Mbits of embedded RAM, low-voltage operation (2.3 V–2.7 V), and an extended operating temperature range of −40 °C to 85 °C — all in a 208-BFQFP surface-mount package.

Key Features

• Core Logic — 21,504 logic elements (cells) and 600,000 gates for implementing combinational and sequential logic designs.
• On-Chip Memory — Approximately 0.129 Mbits (129,024 bits) of embedded RAM to support buffering, state storage, and embedded data structures.
• I/O Density — 158 general-purpose I/O pins to support multiple peripherals, interfaces, and board-level connectivity.
• Power — Operates from a 2.3 V to 2.7 V supply range suitable for low-voltage digital systems.
• Package and Mounting — 208-BFQFP (supplier device package: 208-PQFP, 28 × 28) in a surface-mount footprint for compact PCB implementations.
• Industrial Temperature Range — Rated for operation from −40 °C to 85 °C, suitable for temperature-demanding environments.
• Environmental Compliance — RoHS compliant to meet common lead-free manufacturing requirements.

Typical Applications

• Industrial Control — Implement control logic and I/O interfacing where industrial temperature range and 158 I/Os support diverse sensors and actuators.
• Embedded Systems — Use on-board logic and embedded RAM for custom protocol handling, glue logic, and control tasks in embedded products.
• Communication Interfaces — Provide protocol conversion, timing adaptation, and I/O aggregation leveraging the device’s logic density and I/O count.

Unique Advantages

• High Logic Capacity: 21,504 logic elements enable substantial on-chip combinational and sequential logic integration to consolidate discrete components.
• Significant On-Chip RAM: Approximately 0.129 Mbits of embedded memory reduces the need for external RAM for buffering and small data stores.
• Ample I/O: 158 I/O pins support multiple interfaces and peripheral connections, simplifying board-level routing and design.
• Industrial-Rated Operation: −40 °C to 85 °C operating range makes the device suitable for industrial environments requiring robust thermal performance.
• Low-Voltage Operation: 2.3 V–2.7 V supply supports integration into low-voltage digital power domains.
• Surface-Mount, Compact Package: 208-BFQFP (208-PQFP, 28 × 28) package balances pin count and PCB footprint for space-constrained designs.

Why Choose APA600-PQG208I?

The APA600-PQG208I positions itself as a mid-density ProASICPLUS FPGA that balances logic capacity, on-chip memory, and a high I/O count within an industrial temperature-rated, low-voltage package. Its combination of 21,504 logic elements, approximately 0.129 Mbits of RAM, and 158 I/Os fits designs that require substantial programmable logic and diverse interfacing without excessive board-level complexity.

This part is suitable for engineering teams developing industrial and embedded systems who need a reliable, RoHS-compliant FPGA from Microchip Technology with a compact surface-mount 208-BFQFP footprint and extended temperature capability.

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