APA600-PQG208
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 129024 208-BFQFP |
|---|---|
| Quantity | 555 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 158 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21504 | Number of Logic Elements/Cells | 21504 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 129024 |
Overview of APA600-PQG208 – ProASICPLUS FPGA, 158 I/O, 21,504 Logic Elements, 208-BFQFP
The APA600-PQG208 is a ProASICPLUS Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial embedded applications. This flash-based FPGA integrates 21,504 logic elements and approximately 0.129 Mbits of on-chip RAM to support moderate-density logic and buffering needs while offering up to 158 user I/O pins.
With a 2.3 V to 2.7 V supply range, 208-pin BFQFP package, and surface-mount construction, the APA600-PQG208 is suited for compact board-level integration where predictable power and I/O capability are required within a 0 °C to 70 °C operating range.
Key Features
- Logic Capacity Provides 21,504 logic elements (LEs), enabling implementation of moderate-complexity digital systems and glue-logic integration.
- Embedded Memory Includes 129,024 bits of on-chip RAM (approximately 0.129 Mbits) for data buffering, FIFOs, and small lookup tables.
- Programmable I/O 158 user I/O pins offer flexible external interfacing for sensors, peripherals, and parallel/serial buses.
- Gate Count Approximately 600,000 gates to describe overall device complexity and integration density for mixed logic designs.
- Power Operates from a single 2.3 V to 2.7 V supply, enabling straightforward power supply design in compatible systems.
- Package and Mounting Supplied in a 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28 × 28), simplifying PCB layout for area-constrained designs.
- Commercial Grade Rated for operation from 0 °C to 70 °C, suitable for standard commercial-environment applications.
- Environmental Compliance RoHS compliant for environmental and regulatory conformity in most commercial product lines.
Typical Applications
- Embedded Control Used for implementing control logic, state machines, and interface bridging in embedded systems that require moderate logic density and flexible I/O.
- Consumer Electronics Provides programmable glue logic and peripheral interfacing for consumer devices where compact packaging and surface-mount assembly are needed.
- Communications Equipment Serves in protocol parsing, buffering, and custom logic functions that benefit from on-chip RAM and a substantial number of I/O pins.
- Prototyping & Development Well-suited for proof-of-concept designs and iterative development where reprogrammable logic and moderate resource counts are required.
Unique Advantages
- Balanced Logic and Memory: 21,504 logic elements combined with approximately 0.129 Mbits of embedded RAM enable a mix of combinational logic and local buffering without external memory for many use cases.
- Ample I/O Count: 158 I/O pins support multiple peripheral interfaces and sensor arrays, reducing the need for external I/O expanders.
- Compact Surface-Mount Package: 208-BFQFP package offers a high-pin-count solution in a footprint compatible with automated PCB assembly.
- Straightforward Power Requirements: Single 2.3 V to 2.7 V supply simplifies power-supply design and integration into existing boards.
- Commercial Temperature Range: 0 °C to 70 °C rating fits typical indoor and consumer-facing environments.
- Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for commercial products.
Why Choose APA600-PQG208?
The APA600-PQG208 positions itself as a practical, flash-based FPGA option for designers needing moderate logic capacity, a significant number of I/Os, and on-chip RAM in a surface-mount 208-pin package. Its combination of 21,504 logic elements, approximately 0.129 Mbits of embedded memory, and 158 I/Os makes it appropriate for embedded control, consumer, and communications applications that demand programmable logic without large external memory requirements.
Backed by Microchip Technology and supplied in a commercial-grade, RoHS-compliant package, the APA600-PQG208 offers a reliable and integrable building block for product designs that require scalable programmable logic with predictable supply and temperature characteristics.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the APA600-PQG208. Our team can provide a formal quote to support your procurement and design planning.

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