APA750-BGG456

The APA750-BGG456 is a ProASICPLUS Field Programmable Gate Array from Microchip Technology that provides a high-density, configurable logic solution in a 456-BBGA package. It integrates 32,768 logic elements and approximately 0.147 Mbits of on-chip RAM to support complex programmable logic and glue‑logic functions.

With 356 user I/O, a supply voltage range of 2.3 V to 2.7 V, and commercial-grade operation from 0 °C to 70 °C, this device targets embedded designs that require substantial logic capacity and high I/O counts in a surface-mount, RoHS‑compliant package.

Key Features

• Core Logic 32,768 logic elements (LEs) and approximately 750,000 gates provide capacity for complex combinational and sequential logic implementation.
• Embedded Memory Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for distributed storage and buffering within user logic.
• I/O Density 356 user I/O pins to support extensive external interfacing and signal routing in compact system designs.
• Power and Supply Designed for systems operating from a 2.3 V to 2.7 V supply range, enabling integration into matched power domains.
• Package and Mounting 456-BBGA (supplier device package: 456-PBGA, 35 × 35 mm) in a surface-mount form factor for high-density board layouts.
• Operating Conditions Commercial grade operation from 0 °C to 70 °C suitable for a wide range of non-industrial embedded applications.
• Environmental Compliance RoHS compliant to meet common regulatory requirements for lead‑free assembly.

Typical Applications

• Embedded Control and Glue Logic Integrate control functions and custom glue logic using the device's 32,768 logic elements and plentiful I/O.
• High‑I/O Interface Hubs Route and manage many external signals—suitable where 356 I/O are required for sensor arrays, peripheral aggregation, or board-level signal consolidation.
• Custom Digital Processing Implement tailored digital processing blocks and small accelerators leveraging the on‑chip RAM and gate capacity.

Unique Advantages

• Significant Logic Capacity: 32,768 logic elements and ~750,000 gates allow implementation of sizable custom logic without external ASICs.
• High I/O Count: 356 user I/O reduces the need for additional I/O expanders and simplifies system partitioning.
• Compact, Surface‑Mount Package: 456-BBGA (35 × 35 mm) provides a high‑density mounting option for space-constrained PCBs.
• Flexible Power Integration: 2.3 V to 2.7 V supply range accommodates designs with constrained power rails.
• Regulatory Compatibility: RoHS compliance supports lead‑free manufacturing and environmental requirements.

Why Choose APA750-BGG456?

The APA750-BGG456 positions itself as a high‑capacity, high‑I/O FPGA option for embedded designs that need substantial programmable logic and on‑chip memory in a compact surface‑mount package. Its combination of 32,768 logic elements, approximately 0.147 Mbits of RAM, and 356 I/O pins makes it well suited for designers seeking to consolidate custom logic and interface functions while maintaining a commercial-grade operating envelope.

Backed by Microchip Technology, this device offers a clear specification set—package, supply, temperature range, and RoHS status—allowing straightforward integration into procurement and system design workflows where these exact attributes are required.

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