APA750-FG896I

The APA750-FG896I is a ProASICPLUS FPGA from Microchip Technology providing 32,768 logic elements and 147,456 bits of on-chip RAM in a high-density 896-BGA package. Designed and specified for industrial-grade use, this device supports up to 562 I/O and operates over a wide supply range of 2.3 V to 2.7 V with an ambient temperature range of -40°C to 85°C.

Key Features

• Core Logic — 32,768 logic elements provide substantial programmable logic capacity for mid-density designs.
• Embedded Memory — Approximately 0.147 Mbits of on-chip RAM for buffering, state storage, and small data tables without external memory.
• I/O Density — 562 I/O pins to support complex interfaces, multiple buses, and high channel counts.
• Gate Count — 750,000 gates to describe overall silicon complexity and integration capability.
• Power — Single supply operation from 2.3 V to 2.7 V to match compatible system power rails.
• Package & Mounting — 896-BGA (supplier package: 896-FBGA, 31×31) in a surface-mount form factor for high-density PCB implementations.
• Industrial Grade — Qualified for operation from -40°C to 85°C for use in industrial environments.
• RoHS Compliant — Meets RoHS requirements for restricted substances.

Typical Applications

• Industrial Control — Implement programmable logic, custom state machines, and interface bridging in control systems that require industrial temperature support.
• Embedded Systems — Integrate on-chip memory and high logic density for embedded processing, glue logic, and protocol adaptation.
• High-Density I/O Designs — Support for large peripheral sets, multi-channel sensors, or parallel interfaces thanks to 562 available I/O pins.

Unique Advantages

• High Logic Capacity: 32,768 logic elements enable implementation of complex programmable logic without external ASICs.
• Integrated On-Chip RAM: Approximately 0.147 Mbits of embedded memory reduces the need for external SRAM in many control and buffering tasks.
• Extensive I/O: 562 I/O pins allow dense connectivity for multi-interface and multi-peripheral designs, simplifying board-level routing.
• Industrial Reliability: Specified for -40°C to 85°C operation for deployments in demanding environments.
• Compact, High-Density Package: 896-FBGA (31×31) surface-mount package supports compact PCB layouts while delivering high pin counts.
• Regulatory Compliance: RoHS compliance supports environmentally constrained designs and procurement requirements.

Why Choose APA750-FG896I?

The APA750-FG896I positions itself as a robust, industrial-grade FPGA option for designs that require a balance of logic capacity, on-chip memory, and very high I/O density in a compact BGA package. Its specified operating temperature range and RoHS compliance make it suitable for production deployments where environmental and regulatory considerations matter.

Choose this device when your project needs up to 32,768 logic elements, substantial embedded RAM, and hundreds of I/O pins within a surface-mount 896-FBGA footprint—providing a scalable programmable-logic building block for industrial and embedded applications.

Request a quote or submit an inquiry to purchase APA750-FG896I and to obtain pricing, availability, and ordering information.