APA750-FGG896I

The APA750-FGG896I is a ProASICPLUS FPGA from Microchip Technology delivering 32,768 logic elements and 750,000 gates in a surface-mount 896-BGA package. It integrates approximately 0.147 Mbits of on-chip RAM and supports up to 562 I/O pins, making it suitable for designs that require moderate logic density and high I/O count.

Designed for industrial use, the device operates from a 2.3 V to 2.7 V supply and across an operating temperature range of −40 °C to 85 °C, providing a balanced combination of integration, I/O capacity, and temperature capability for embedded applications.

Key Features

• Logic Capacity  32,768 logic elements providing up to 750,000 gates of programmable logic for implementing complex digital functions.
• On-chip Memory  Approximately 0.147 Mbits of total RAM bits available for embedded data storage and buffering within the FPGA fabric.
• High I/O Count  562 I/O pins to support dense external interfacing and multiple parallel connections to peripherals and external logic.
• Supply Voltage  Operates from 2.3 V to 2.7 V, enabling compatibility with low-voltage system domains.
• Industrial Temperature Range  Rated for operation from −40 °C to 85 °C to meet industrial-environment requirements.
• Package and Mounting  896-BGA (supplier package: 896-FBGA, 31×31) in a surface-mount format for board-level integration and compact system designs.
• Manufacturer  Microchip Technology supply and part identification as APA750-FGG896I.
• RoHS Compliant  Conforms to RoHS requirements for restricted hazardous substances.

Unique Advantages

• High logic density: 32,768 logic elements and 750,000 gates enable implementation of substantial digital functions within a single FPGA.
• Ample embedded memory: Approximately 0.147 Mbits of on-chip RAM supports local buffering, small lookup tables, and state storage without external memory.
• Large I/O capability: 562 I/Os reduce the need for external multiplexing or I/O expanders when interfacing with multiple peripherals and buses.
• Industrial-grade temperature tolerance: −40 °C to 85 °C rating supports deployment in a wide range of environmental conditions.
• Compact, board-ready package: 896-BGA (31×31) surface-mount package facilitates high-density PCB layouts and reliable solder attachment.
• Low-voltage operation: 2.3 V to 2.7 V supply range allows integration into modern low-voltage system architectures.

Why Choose APA750-FGG896I?

The APA750-FGG896I combines significant logic resources, a large I/O count, and embedded RAM in an industrial-grade, surface-mount 896-BGA package from Microchip Technology. Its balance of logic capacity, memory, and I/O makes it appropriate for embedded designs that require on-chip programmable logic with robust environmental capability.

This device is a practical choice for engineers seeking a mid-to-high density FPGA with broad I/O connectivity and industrial temperature support, while maintaining a compact board footprint and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for the APA750-FGG896I and support for integrating this FPGA into your next design.