APA750-FGG896A

IC FPGA 562 I/O 896FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 562 147456 896-BGA

Quantity 1,274 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case896-BGANumber of I/O562Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32768Number of Logic Elements/Cells32768
Number of Gates750000ECCN3A001A7AHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits147456

Overview of APA750-FGG896A – ProASICPLUS FPGA, 562 I/O, 896-BGA

The APA750-FGG896A is a ProASICPLUS field programmable gate array (FPGA) IC designed for applications that require mid-range logic capacity with high I/O density and automotive-grade qualification. This device combines 32,768 logic elements, approximately 0.15 Mbits of embedded memory, and up to 562 general-purpose I/O pins in a 896-ball FBGA package to support complex system-level integration.

With AEC-Q100 qualification, a wide operating temperature range from -40 °C to 125 °C, and RoHS compliance, the APA750-FGG896A is positioned for designs that require reliability and durability in demanding environments.

Key Features

  • Core Logic 32,768 logic elements (equivalent CLBs) and approximately 750,000 gates provide flexible mid-range programmable logic for control, glue-logic, and protocol implementation.
  • Embedded Memory Approximately 0.15 Mbits (147,456 bits) of on-chip RAM to support buffering, small FIFOs, and state storage without external memory.
  • I/O Density Up to 562 I/O pins enable high pin-count interfacing for multi-sensor aggregation, gateway functions, and large bus connectivity.
  • Package & Mounting 896-ball FBGA (31 × 31 mm) package designed for surface-mount assembly to maximize board-level routing and density.
  • Power Supply Narrow core voltage supply range from 2.375 V to 2.625 V to match targeted system power rails and allow predictable power budgeting.
  • Automotive Qualification AEC-Q100 qualification and an operating range of -40 °C to 125 °C support deployment in temperature-critical and automotive-grade applications.
  • Regulatory RoHS compliant for environmentally responsible designs and manufacturing.

Typical Applications

  • Automotive Control Modules AEC-Q100 qualification and wide temperature range make the APA750-FGG896A suitable for control and interface functions in vehicle electronics.
  • High-Density I/O Bridging Large I/O count supports signal aggregation, board-level bridging, and complex peripheral interfacing where many external signals must be managed.
  • Embedded System Logic Mid-range logic capacity and on-chip RAM enable implementation of control logic, serial protocol handling, and moderate data buffering without external devices.
  • Rugged / Temperature-Driven Designs Operation from -40 °C to 125 °C addresses deployments that require consistent behavior across harsh thermal environments.

Unique Advantages

  • Automotive-Grade Qualification: AEC-Q100 certification provides confidence for use in vehicle electronics and other applications requiring automotive-level reliability.
  • High I/O Integration: 562 I/Os reduce the need for external multiplexers or expanders, simplifying board layout and lowering BOM complexity.
  • Balanced Logic and Memory: 32,768 logic elements paired with approximately 0.15 Mbits of embedded RAM enable flexible partitioning of control, state machines, and buffering tasks on-chip.
  • Compact, High-Pin-Count Package: 896-FBGA (31 × 31 mm) delivers significant I/O and routing density in a surface-mount form factor suitable for modern PCB designs.
  • Predictable Power Envelope: Defined supply range (2.375 V–2.625 V) supports consistent power design and simplifies rail provisioning.
  • RoHS Compliance: Environmentally compliant manufacturing for projects with regulatory and supply-chain requirements.

Why Choose APA750-FGG896A?

The APA750-FGG896A delivers a practical combination of logic capacity, on-chip memory, and one of the highest I/O counts available in its footprint, all within an AEC-Q100-qualified package. It is well suited for engineers designing automotive and rugged embedded systems that demand reliable operation across a wide temperature range and require high pin density for complex peripheral and sensor interfaces.

For teams looking to consolidate functionality, reduce external component count, and maintain predictable power and thermal behavior, this ProASICPLUS FPGA offers a balanced platform supported by clear specifications for integration into production designs.

Request a quote or submit an inquiry to get pricing and availability for the APA750-FGG896A and support options for your next design.

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