APA750-PQ208

The APA750-PQ208 is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for commercial electronic applications. It delivers a balanced mix of logic capacity, on-chip memory and I/O density for mid-range programmable logic tasks.

Key hardware characteristics include 32,768 logic elements (LEs), approximately 0.15 Mbits of embedded memory (147,456 bits), 158 I/O pins, and a 208-BFQFP surface-mount package. The device operates from 2.3 V to 2.7 V and within a commercial temperature range of 0 °C to 70 °C, and is RoHS compliant.

Key Features

• Logic Capacity  32,768 logic elements and an estimated 750,000 gates provide capacity for mid-density digital designs and glue-logic integration.
• Embedded Memory  Approximately 0.15 Mbits of on-chip RAM (147,456 bits) supports buffering, small FIFOs and local data storage.
• I/O and Package  158 user I/Os in a 208-BFQFP package (supplier package: 208-PQFP, 28×28) for broad peripheral and bus interfacing in a compact surface-mount form factor.
• Power  Operates from a 2.3 V to 2.7 V supply range suitable for low-voltage system domains.
• Thermal and Grade  Commercial operating temperature range of 0 °C to 70 °C, targeted for general-purpose electronic products.
• Compliance and Mounting  RoHS compliant and designed for surface-mount assembly to meet modern manufacturing requirements.

Typical Applications

• Consumer Electronics Control  Implement user-interface control, display driving logic and peripheral management using the device’s I/O density and logic resources.
• Protocol Bridging and Glue Logic  Use the FPGA to consolidate interface translation and timing adaptation between different system buses and peripherals.
• Embedded I/O Consolidation  Centralize sensor and actuator interfacing for embedded systems leveraging 158 I/Os and on-chip memory for local buffering.
• Prototyping and Mid-Density Designs  Rapidly validate and iterate digital designs that require a balance of logic elements and embedded memory in a commercial-grade device.

Unique Advantages

• Balanced Logic and Memory: 32,768 logic elements with approximately 0.15 Mbits of embedded RAM provides the right mix for many mid-range FPGA tasks without excessive overhead.
• High I/O Count in a Compact Package: 158 I/Os in a 208-BFQFP (208-PQFP 28×28) package allows extensive peripheral connectivity while maintaining a compact board footprint.
• Low-Voltage Operation: 2.3 V to 2.7 V supply range supports integration into low-voltage system domains.
• Surface-Mount Ready: Designed for surface-mount assembly to fit modern manufacturing workflows.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly and regulatory alignment.

Why Choose APA750-PQ208?

The APA750-PQ208 positions itself as a practical FPGA choice for commercial electronic designs that need a balanced combination of logic capacity, embedded memory and plentiful I/O in a compact surface-mount package. Its specification set—32,768 logic elements, ~0.15 Mbits of RAM, 158 I/Os, and a 208-BFQFP package—makes it well suited for control logic, interface consolidation and mid-density programmable applications.

Backed by Microchip Technology, the device offers a straightforward path for designers and procurement teams seeking a commercially graded FPGA with clear electrical and thermal parameters and RoHS compliance, supporting predictable integration into production designs.

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