APA750-PQ208I

The APA750-PQ208I is a ProASICPLUS field programmable gate array (FPGA) device designed for surface-mount applications. It provides a dense logic fabric with 32,768 logic elements (approximately 750,000 gates), on-chip embedded memory and a substantial I/O count in a 208-pin BFQFP package.

This industrial-grade FPGA supports a 2.3 V to 2.7 V supply range and an operating temperature range of -40 °C to 85 °C, making it suitable for embedded and industrial designs that require logic integration, configurable interfaces and moderate on-chip memory.

Key Features

• Core Logic 32,768 logic elements providing a total of approximately 750,000 gates for implementing custom digital logic and finite-state machines.
• Embedded Memory 147,456 bits of on-chip RAM — approximately 0.14 Mbits of embedded memory for small data buffers and state storage.
• I/O Count 158 general-purpose I/O pins to support multiple interfaces, sensors and peripheral connections in a single device.
• Package and Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB assembly.
• Power Narrow supply range of 2.3 V to 2.7 V to match system rails and simplify power sequencing.
• Temperature and Grade Industrial grade device with an operating temperature range of -40 °C to 85 °C for use in extended-temperature environments.
• Environmental Compliance RoHS compliant to support regulatory and lead-free manufacturing requirements.

Typical Applications

• Embedded System Integration Implement glue logic, custom interface controllers and peripheral management using the device's abundant logic elements and 158 I/Os.
• Industrial Control Deploy control and monitoring functions in industrial environments leveraging the device's industrial temperature range and surface-mount package.
• Prototyping and Development Use the FPGA for hardware prototyping, algorithm validation and digital design iteration with on-chip memory and configurable I/O.
• Interface Bridging Create custom protocol bridges and signal adapters using available I/O resources and programmable logic to match system requirements.

Unique Advantages

• High logic density: 32,768 logic elements and approximately 750,000 gates allow compact implementation of complex digital functions on a single device.
• Integrated on-chip memory: Approximately 0.14 Mbits of embedded RAM reduces dependence on external memory for small buffers and state storage.
• Generous I/O count: 158 I/Os enable multiple peripheral connections and flexible interface routing without additional devices.
• Industrial temperature capability: Rated for -40 °C to 85 °C to support extended-temperature deployments in industrial systems.
• Compact, surface-mount packaging: 208-BFQFP / 208-PQFP (28×28) package supports automated PCB assembly and dense board layouts.
• RoHS compliant: Designed for lead-free manufacturing processes and regulatory compliance.

Why Choose APA750-PQ208I?

The APA750-PQ208I positions itself as a compact, industrial-grade FPGA option that combines substantial logic capacity, embedded memory and a wide complement of I/Os in a surface-mount 208-pin BFQFP package. Its supply voltage range and temperature rating make it suitable for embedded and industrial designs that require configurable logic and reliable operation across extended temperatures.

This device is suited to engineers and designers building systems that need on-board programmability, flexible interfacing and moderate embedded memory without moving to larger, higher-cost platforms. Its combination of logic elements, I/O count and package footprint supports scalable designs and streamlined bill-of-materials choices.

Request a quote or contact sales to submit a quote for APA750-PQ208I and discuss availability, pricing and lead times for your design requirements.