APA750-PQG208A

The APA750-PQG208A is a ProASICPLUS FPGA device from Microchip Technology designed for embedded logic and I/O integration. It delivers 32,768 logic elements and approximately 0.144 Mbits of on-chip RAM, making it suitable for mid-density programmable logic tasks that require a balanced mix of logic, memory and flexible I/O.

With 158 user I/O pins, a supply voltage window of 2.375 V to 2.625 V, and automotive-grade qualification (AEC-Q100), this device targets applications that demand reliable operation across a wide temperature range and rigorous qualification requirements.

Key Features

• Core Logic  32,768 logic elements (cells) and approximately 750,000 gates provide a mid-density programmable fabric for custom logic, protocol handling, and glue-logic functions.
• Embedded Memory  Approximately 0.144 Mbits of on-chip RAM (147,456 bits) supports buffering, lookup tables, and small state machines without external memory.
• I/O and Integration  158 user I/O pins enable flexible interfacing to sensors, peripherals, and system buses in compact board layouts.
• Power  Single supply operating range from 2.375 V to 2.625 V for predictable power planning in system designs.
• Package & Mounting  208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for space-conscious PCB designs.
• Automotive Qualification & Temperature Range  AEC-Q100 qualified and rated for operation from −40 °C to 125 °C, supporting designs with automotive-level reliability requirements.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Automotive Control Systems  Use the AEC-Q100-qualified FPGA for control, monitoring, or signal-management tasks that require reliable operation across broad temperatures.
• Sensor Interfaces  Leverage the device’s 158 I/O pins and embedded memory to aggregate and preprocess sensor data before passing it to host processors.
• Protocol Bridging and Custom Interfaces  Implement protocol conversion, bus bridging, and custom timing logic where mid-density logic plus flexible I/O are required.
• Industrial Control  Apply the qualified temperature range and robust packaging for industrial automation, motor control interfaces, and system glue logic.

Unique Advantages

• Automotive-qualified reliability: AEC-Q100 qualification and −40 °C to 125 °C operating range provide confidence for deployed automotive and harsh-environment systems.
• Balanced logic and memory: 32,768 logic elements combined with approximately 0.144 Mbits of RAM supports a wide range of mid-complexity functions without external memory.
• High I/O count in a compact package: 158 user I/Os in a 208-BFQFP surface-mount package enable dense board integration while maintaining extensive peripheral connectivity.
• Predictable power envelope: A specified supply range of 2.375 V to 2.625 V simplifies power-supply design and system integration.
• Standards-compliant materials: RoHS compliance supports regulatory and manufacturing requirements for lead-free assemblies.

Why Choose APA750-PQG208A?

The APA750-PQG208A positions itself as a mid-density, automotive-qualified FPGA solution that combines substantial logic resources, embedded memory, and a high I/O count in a compact surface-mount package. Its constrained supply voltage range and AEC-Q100 qualification make it suitable for designers who require predictable electrical behavior and proven temperature performance.

Ideal for teams developing automotive subsystems, industrial controllers, or custom interface logic, the device offers a balance of integration and robustness that supports long-term deployment where qualification and operational range matter.

Request a quote or submit an inquiry to discuss pricing, availability, and specific order requirements for the APA750-PQG208A.