APA750-FGG896

The APA750-FGG896 is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial-grade embedded logic applications. It provides a balance of I/O capacity, logic resources and on‑chip memory suitable for complex digital designs that require high pin counts and moderate embedded RAM.

With 32,768 logic elements, 562 I/Os and approximately 0.147 Mbits of embedded memory, this device is sized for designs that need substantial gate count and connective density while operating within a 2.3 V to 2.7 V supply range and a 0 °C to 70 °C commercial temperature window.

Key Features

• Logic Capacity  32,768 logic elements (LEs) delivering up to 750,000 gates for implementing complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 0.147 Mbits of on‑chip RAM to support buffering, FIFOs and small lookup table storage without external memory.
• I/O Density  562 user I/O pins to support high‑pin‑count interfaces and multi‑channel connectivity in a single device.
• Power Supply  Operates from a 2.3 V to 2.7 V supply window, enabling designs constrained to low‑voltage power rails.
• Package and Mounting  896‑BGA package (supplier device package: 896‑FBGA, 31×31) in a surface‑mount form factor for compact board layouts.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 70 °C suitable for standard commercial applications.
• Regulatory  RoHS compliant for environmental and manufacturing process considerations.

Typical Applications

• High‑density I/O systems  Used where large numbers of signals must be routed and managed on a single FPGA, leveraging the 562 I/O pins to consolidate interfaces.
• Custom digital controllers  Implements application‑specific state machines and control logic using the 32,768 logic elements and 750,000‑gate capacity.
• Embedded memory buffering  On‑chip RAM supports temporary data storage and buffering tasks without mandatory external memory components.

Unique Advantages

• High I/O count: 562 I/Os reduce the need for external multiplexing or additional interface ICs, simplifying board-level design.
• Substantial logic resources: 32,768 logic elements and 750,000 gates enable implementation of sizeable custom logic and parallel processing blocks.
• On‑chip memory: Approximately 0.147 Mbits of embedded RAM supports local data buffering and lookup tables, lowering BOM complexity.
• Compact BGA footprint: 896‑BGA (31×31) surface‑mount package allows for dense PCB routing while maintaining a single FPGA solution.
• Commercial grade operation: Specified for 0 °C to 70 °C operation and RoHS compliance for standard commercial product deployments.
• Low‑voltage operation: 2.3 V to 2.7 V supply range fits designs using lower supply rails and modern power architectures.

Why Choose APA750-FGG896?

The APA750-FGG896 delivers a balanced combination of logic density, I/O capacity and embedded memory in a compact BGA package, making it well suited to commercial embedded designs that require consolidated interfaces and substantial on‑chip resources. Its operating voltage range, RoHS compliance and commercial temperature rating position it for standard product and prototype development where reliability and integration are important.

Backed by Microchip Technology, this ProASICPLUS FPGA is appropriate for engineering teams building custom digital logic, high‑pin‑count interface solutions and embedded controllers that benefit from a single‑chip implementation of logic and memory resources.

Request a quote or submit an inquiry to receive pricing and availability for the APA750-FGG896 and to discuss how it can fit your next design.