APA750-FG896A

The APA750-FG896A from Microchip Technology is a ProASICPLUS family field programmable gate array (FPGA) supplied in an 896-BGA package. It provides a combination of high logic capacity, extensive I/O, and automotive-grade qualification for designs that require compact programmable logic with robust operational range.

With 32,768 logic elements, 562 user I/Os and on-chip RAM, this device targets applications needing dense interfacing, consolidated logic functions and reliable operation across a wide temperature range.

Key Features

• Logic Capacity  32,768 logic elements supporting up to 750,000 gates of implementable logic for complex designs.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, state storage and small data structures.
• High I/O Count  562 user I/O pins to accommodate high-density interfacing and multiple external peripherals.
• Package and Mounting  896-BGA (supplier device package: 896-FBGA, 31×31) surface-mount package for compact, high-density PCB implementations.
• Power Requirements  Nominal supply voltage range of 2.375 V to 2.625 V to match tightly controlled system power rails.
• Temperature and Qualification  Automotive grade device with AEC-Q100 qualification and an operating temperature range of −40°C to 125°C for demanding environments.
• Environmental Compliance  RoHS compliant for lead-free assembly and environmental regulation adherence.

Typical Applications

• Automotive control modules  AEC-Q100 qualification and −40°C to 125°C operation make this FPGA suitable for in-vehicle control and processing tasks that require reliable operation across temperature extremes.
• High-density interface bridging  562 I/Os enable protocol translation, signal aggregation and interconnect functions where many external connections are required.
• Embedded logic consolidation  32,768 logic elements and 750,000 gates allow integration of multiple logic functions onto a single device to reduce board-level component count.
• On-chip buffering and state retention  Approximately 0.147 Mbits of embedded memory supports small buffers, FIFOs and local state storage for timing-critical paths.

Unique Advantages

• High integration density: Large logic capacity and gate count enable consolidation of complex functions into a single FPGA, simplifying board design.
• Extensive I/O availability: 562 user I/Os reduce the need for external multiplexers or expanders, lowering BOM complexity.
• Automotive-ready qualification: AEC-Q100 qualification and wide operating temperature range support deployment in automotive applications.
• Compact BGA footprint: The 896-BGA (31×31) surface-mount package provides a small footprint for space-constrained designs.
• Controlled supply window: Narrow operating voltage range (2.375–2.625 V) simplifies power-rail planning and consistency across units.
• RoHS compliance: Enables lead-free manufacturing and aligns with environmental requirements.

Why Choose APA750-FG896A?

The APA750-FG896A positions itself as a high-capacity, automotive-qualified FPGA option well suited for designs that demand large logic resources, significant I/O counts and reliable operation across extended temperatures. Its combination of 32,768 logic elements, substantial gate count and compact 896-BGA package makes it appropriate for systems that require dense integration and dependable performance.

Choose this device when your design requires a balance of logic density, on-chip memory and a high pin count in an automotive-grade, surface-mount package to support robust, long-term deployment in challenging environments.

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