APA750-FG896

The APA750-FG896 from Microchip Technology is a ProASICPLUS field programmable gate array (FPGA) device targeted at commercial electronic designs. It provides a balanced combination of programmable logic capacity, embedded memory, and a high I/O count in a compact 896-ball BGA package.

With 32,768 logic elements, approximately 0.14 Mbits of embedded memory, and 562 user I/Os, this device is suited for applications that require substantial I/O density and mid-range logic integration while operating from a 2.3 V to 2.7 V supply in a 0 °C to 70 °C commercial temperature range.

Key Features

• Logic Capacity  32,768 logic elements (equivalent to the listed logic element cell count), supporting designs with up to 750,000 equivalent gates for mid-density programmable logic integration.
• Embedded Memory  147,456 bits of on-chip RAM, approximately 0.14 Mbits of embedded memory for buffering, LUTs, and small data storage needs.
• High I/O Density  562 user I/Os to support dense peripheral interfacing or multiple parallel interfaces within a single device.
• Power and Supply  Operates from a 2.3 V to 2.7 V supply, enabling compatibility with low-voltage system rails.
• Package and Mounting  896-ball FBGA package (31 × 31) in a surface-mount form factor for compact board-level integration.
• Commercial Grade Temperature  Rated for 0 °C to 70 °C operation for commercial applications.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Commercial Embedded Systems  Integration of programmable logic where a combination of mid-range gate count and high I/O is required within commercial temperature limits.
• I/O-Intensive Control  Control panels and interface hubs that need hundreds of signal connections can leverage the 562 I/Os to consolidate functionality into one FPGA.
• Prototyping and System Integration  Development platforms and prototype systems that require reprogrammable logic with substantial element count and on-chip RAM for early validation and integration.

Unique Advantages

• Balanced Logic and I/O  Combines 32,768 logic elements with 562 I/Os to address designs that need both logic capacity and extensive external connectivity.
• Compact BGA Footprint  The 896-ball FBGA (31 × 31) package provides a high pin count in a compact surface-mount package, saving board area compared with multi-chip solutions.
• Embedded Memory On-Board  Approximately 0.14 Mbits of on-chip RAM reduces the need for external memory for small buffers and LUT-based functions.
• Commercial Deployment Ready  Rated for 0 °C to 70 °C and RoHS compliant, making the device suitable for a wide range of commercial product deployments.
• Reduced BOM Count  High integration of logic, I/Os, and on-chip memory helps simplify system architecture and lower component count.

Why Choose APA750-FG896?

The APA750-FG896 is positioned for commercial designers who need a mid-density FPGA with substantial I/O capacity and embedded memory in a compact BGA package. Its 32,768 logic elements, roughly 0.14 Mbits of RAM, and 562 I/Os provide a pragmatic balance of integration and board-level consolidation for complex commercial designs.

Choose this Microchip Technology ProASICPLUS device when your design requires a single-chip solution that combines moderate logic density, on-chip memory, and high connector count while meeting commercial temperature and RoHS requirements.

Request a quote or submit an inquiry to check pricing and availability for APA750-FG896 and to discuss how this device can fit into your next commercial design.