APA600-BG456M

The APA600-BG456M is a ProASICPLUS field programmable gate array from Microchip Technology, offered in a 456-ball ball-grid array package. This military-grade FPGA provides a balance of logic capacity, on-chip memory, and high I/O count for reliability-conscious embedded designs.

Qualified to MIL-STD-883 and specified for operation from -55 °C to 125 °C, the device is intended for applications requiring rugged qualification, substantial I/O, and moderate embedded memory and logic resources.

Key Features

• Core Logic — 21,504 logic elements supporting approximately 600,000 gates for implementing complex digital functions.
• Embedded Memory — 129,024 total RAM bits (approximately 0.13 Mbits) of on-chip memory for buffering, state storage, and small data structures.
• I/O Capacity — 356 user I/O pins to support dense external interfacing and parallel connectivity.
• Package & Mounting — 456-BBGA package (456-PBGA, 35×35) in a surface-mount form factor for high-pin-count board designs.
• Power — Single supply operation from 2.3 V to 2.7 V to match system-level power rails.
• Qualification & Temperature — Military grade with MIL-STD-883 qualification and an operating temperature range of -55 °C to 125 °C for high-reliability environments.

Typical Applications

• Military and Aerospace Systems — Use in designs that require MIL-STD-883 qualification and extended temperature operation.
• High-Density I/O Interfaces — Ideal for systems that need many external connections, leveraging 356 I/O pins for sensor arrays, data links, or parallel buses.
• Embedded Control and Processing — Suitable for embedded logic implementations that benefit from 21,504 logic elements and on-chip RAM for control state and buffering.

Unique Advantages

• High Logic Capacity: 21,504 logic elements and roughly 600,000 gates allow implementation of substantial digital logic without external CPLDs.
• Significant I/O Count: 356 user I/O pins enable rich external interfacing and reduce the need for additional interface components.
• Qualified for Military Use: MIL-STD-883 qualification and -55 °C to 125 °C operating range support deployment in demanding environments.
• Compact, High-Pin Package: 456-BBGA (35×35 PBGA) provides a high pin count in a compact surface-mount footprint for dense PCB layouts.
• Integrated On-Chip Memory: 129,024 bits of embedded RAM (approximately 0.13 Mbits) for local buffering and state retention.
• Low-Voltage Operation: 2.3 V to 2.7 V supply compatibility supports modern system power architectures.

Why Choose APA600-BG456M?

The APA600-BG456M positions itself as a military-qualified FPGA that combines considerable logic resources, a high number of I/O pins, and on-chip memory within a compact 456-ball BGA package. Its MIL-STD-883 qualification and extended temperature range make it suited to designs where reliability and environmental tolerance are critical.

This device is well suited for engineers building rugged embedded systems that require a balance of logic density, interfacing capacity, and qualification-backed reliability. Its specification set supports scalable designs that benefit from a single-chip programmable solution backed by Microchip Technology's ProASICPLUS lineage.

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