APA600-BG456I

The APA600-BG456I is a ProASICPLUS Field Programmable Gate Array (FPGA) IC offering a mid-density programmable fabric suitable for industrial applications. It provides 21,504 logic elements (cells), approximately 0.13 Mbits of embedded memory, and a high I/O count to support complex glue logic, control functions, and high-density interfacing.

Designed for surface-mount deployment in a 456-ball BBGA footprint with a 35×35 supplier device package, this device operates from a 2.3 V to 2.7 V supply and is specified for industrial temperature operation from −40 °C to 85 °C.

Key Features

• Core Logic  21,504 logic elements (cells) providing substantial programmable resources for mid-density digital designs.
• Gate Equivalent  600,000 gates, enabling implementation of complex finite state machines, control paths, and custom logic networks.
• Embedded Memory  Approximately 0.13 Mbits of on-chip RAM (129,024 bits) for buffering, FIFO storage, and small lookup tables.
• High I/O Count  356 user I/Os to support extensive peripheral interfacing, bus bridging, and multi-channel signal routing.
• Packaging & Mounting  456-ball BBGA package (supplier device package: 456-PBGA, 35×35) optimized for surface-mount assembly and compact board layouts.
• Power  Operates from a 2.3 V to 2.7 V supply range to match common system rails and low-voltage domains.
• Temperature & Grade  Industrial-grade device specified for operation from −40 °C to 85 °C for reliable performance in demanding environments.
• Environmental Compliance  RoHS compliant to meet standard material and environmental requirements.

Typical Applications

• Industrial Control & Automation  Implement machine control logic, sensor interfacing, and deterministic I/O processing using the device’s logic capacity and industrial temperature range.
• Embedded Systems  Provide custom glue logic, protocol adaptation, and peripheral aggregation where high I/O density and on-chip memory reduce board-level complexity.
• Test & Measurement Equipment  Use the FPGA for data capture, preprocessing, and I/O routing in compact, surface-mount form factors.
• Communications & Networking Modules  Deploy as a programmable interface engine or protocol adapter benefitting from the large I/O count and logic resources.

Unique Advantages

• High I/O Density: 356 user I/Os accommodate extensive peripheral and bus connections without external multiplexing.
• Significant Logic Capacity: 21,504 logic elements support mid-density designs that require substantial programmable resources.
• On-chip Memory: Approximately 0.13 Mbits of embedded RAM for local buffering and small data structures, reducing external memory needs.
• Industrial Temperature Rating: Specified operation from −40 °C to 85 °C for deployment in factory, industrial, and outdoor equipment.
• Compact Surface-Mount Package: 456-BBGA (456-PBGA, 35×35) enables high-density board layouts while maintaining robust electrical connectivity.
• RoHS Compliant: Meets standard environmental material requirements for commercial and industrial assemblies.

Why Choose APA600-BG456I?

The APA600-BG456I balances a substantial logic element count, sizable on-chip RAM, and a very high I/O complement in a compact BBGA footprint, making it well suited for industrial and embedded designs that require mid-density programmable logic and extensive external interfacing. Its 2.3 V–2.7 V supply range and −40 °C to 85 °C operating range provide design flexibility for a broad set of environments.

For engineers specifying programmable logic to simplify boards, consolidate glue logic, or implement custom control and interface functions, the APA600-BG456I delivers verifiable on-chip resources and packaging options that support compact, surface-mounted system designs.

If you would like pricing, availability, or to request a quote for the APA600-BG456I, submit a quote request or contact sales with your quantity and delivery requirements.