Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AS4C16M16D1-5TCNAS4C16M16D1-5TCNAlliance Memory, Inc.IC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,217
AS4C16M16D1-5TCNTRAS4C16M16D1-5TCNTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,078
AS4C16M16D1-5TINAS4C16M16D1-5TINAlliance Memory, Inc.IC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
226
AS4C16M16D1-5TINTRAS4C16M16D1-5TINTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,092
AS4C16M16D1A-5TCNAS4C16M16D1A-5TCNAlliance Memory, Inc.IC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
593
AS4C16M16D1A-5TCNTRAS4C16M16D1A-5TCNTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
309
AS4C16M16D1A-5TINAS4C16M16D1A-5TINAlliance Memory, Inc.IC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
525
AS4C16M16D1A-5TINTRAS4C16M16D1A-5TINTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 66TSOP IIMemory66-TSOP II2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
66-TSSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,738
AS4C16M16D2-25BCNAS4C16M16D2-25BCNAlliance Memory, Inc.IC DRAM 256MBIT PAR 84TFBGAMemory84-TFBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
391
AS4C16M16D2-25BCNTRAS4C16M16D2-25BCNTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 84TFBGAMemory84-TFBGA (8x12.5)1.7V ~ 1.9V0°C ~ 85°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
317
AS4C16M16D2-25BINAS4C16M16D2-25BINAlliance Memory, Inc.IC DRAM 256MBIT PAR 84TFBGAMemory84-TFBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 95°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
602
AS4C16M16D2-25BINTRAS4C16M16D2-25BINTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 84TFBGAMemory84-TFBGA (8x12.5)1.7V ~ 1.9V-40°C ~ 95°C (TC)
Access Time:
400 ps
Clock Frequency:
400 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
84-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR2
Write Cycle Time Word Page:
15 ns
879
N/AAS4C16M16MD1A-6BINAlliance Memory, Inc.IC DRAM 256MBIT PARALLEL 60FBGAMemory60-FBGA (8x9)1.7V ~ 1.95V-40°C ~ 85°C (TA)
Access Time:
5.5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVCMOS
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
859
N/AAS4C16M16MD1A-6BINTRAlliance Memory, Inc.IC DRAM 256MBIT PARALLEL 60FBGAMemory60-FBGA (8x9)1.7V ~ 1.95V-40°C ~ 85°C (TA)
Access Time:
5.5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVCMOS
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
839
AS4C16M16S-6BINAS4C16M16S-6BINAlliance Memory, Inc.IC DRAM 256MBIT PAR 54TFBGAMemory54-TFBGA (8x8)3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5.4 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
1,645
AS4C16M16S-6BINTRAS4C16M16S-6BINTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 54TFBGAMemory54-TFBGA (8x8)3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5.4 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
1,940
AS4C16M16S-6TANAS4C16M16S-6TANAlliance Memory, Inc.IC DRAM 256MBIT PAR 54TSOP IIMemory54-TSOP II3V ~ 3.6V-40°C ~ 105°C (TA)
Access Time:
5.4 ns
Clock Frequency:
166 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
1,414
AS4C16M16S-6TANTRAS4C16M16S-6TANTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 54TSOP IIMemory54-TSOP II3V ~ 3.6V-40°C ~ 105°C (TA)
Access Time:
5.4 ns
Clock Frequency:
166 MHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
1,315
AS4C16M16S-6TCNAS4C16M16S-6TCNAlliance Memory, Inc.IC DRAM 256MBIT PAR 54TSOP IIMemory54-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
166 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
1,251
AS4C16M16S-6TCNTRAS4C16M16S-6TCNTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 54TSOP IIMemory54-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
166 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
242

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