Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AS4C16M16SB-6BINAS4C16M16SB-6BINAlliance Memory, Inc.IC DRAM 256MBIT LVTTL 54TFBGAMemory54-TFBGA (8x8)3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
1,516
AS4C16M16SB-6BINTRAS4C16M16SB-6BINTRAlliance Memory, Inc.IC DRAM 256MBIT LVTTL 54TFBGAMemory54-TFBGA (8x8)3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
1,243
AS4C16M16SB-6TINAS4C16M16SB-6TINAlliance Memory, Inc.IC DRAM 256MBIT LVTTL 54TSOP IIMemory54-TSOP II3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
1,744
AS4C16M16SB-6TINTRAS4C16M16SB-6TINTRAlliance Memory, Inc.IC DRAM 256MBIT LVTTL 54TSOP IIMemory54-TSOP II3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
680
AS4C16M16SB-7TCNAS4C16M16SB-7TCNAlliance Memory, Inc.IC DRAM 256MBIT LVTTL 54TSOP IIMemory54-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
143 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
14 ns
175
AS4C16M16SB-7TCNTRAS4C16M16SB-7TCNTRAlliance Memory, Inc.IC DRAM 256MBIT LVTTL 54TSOP IIMemory54-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
143 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
14 ns
629
AS4C16M32MD1B-5BINAS4C16M32MD1B-5BINAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 90FBGAMemory90-FBGA (8x13)1.7V ~ 1.95V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVCMOS
Memory Organization:
16M x 32
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
90-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,455
AS4C16M32MD1B-5BINTRAS4C16M32MD1B-5BINTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 90FBGAMemory90-FBGA (8x13)1.7V ~ 1.95V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVCMOS
Memory Organization:
16M x 32
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
90-VFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,208
AS4C16M32MSB-6BINAS4C16M32MSB-6BINAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 90FBGAMemory90-FBGA (8x13)1.7V ~ 1.95V-40°C ~ 85°C (TA)
Access Time:
5.5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 32
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
90-VFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
15 ns
338
AS4C16M32MSB-6BINTRAS4C16M32MSB-6BINTRAlliance Memory, Inc.IC DRAM 512MBIT PARALLEL 90FBGAMemory90-FBGA (8x13)1.7V ~ 1.95V-40°C ~ 85°C (TA)
Access Time:
5.5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 32
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
90-VFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
15 ns
1,254
AS4C16M32SB-6BCNAS4C16M32SB-6BCNAlliance Memory, Inc.SDR, 512MB, 16M X 32, 3.3V, 54-BMemory90-TFBGA (8x13)3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
166 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
16M x 32
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
90-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
562
AS4C16M32SB-6BCNTRAS4C16M32SB-6BCNTRAlliance Memory, Inc.SDR, 512MB, 16M X 32, 3.3V, 54-BMemory90-TFBGA (8x13)3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
166 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
16M x 32
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
90-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
298
AS4C16M32SC-7TINAS4C16M32SC-7TINAlliance Memory, Inc.IC DRAM 512MBIT PAR 86TSOP IIMemory86-TSOP II3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
17 ns
Clock Frequency:
133 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 32
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
86-TFSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
15 ns
967
AS4C16M32SC-7TINTRAS4C16M32SC-7TINTRAlliance Memory, Inc.IC DRAM 512MBIT PAR 86TSOP IIMemory86-TSOP II3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
17 ns
Clock Frequency:
133 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 32
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
86-TFSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
15 ns
1,237
AS4C1G32MD4V-046BINAS4C1G32MD4V-046BINAlliance Memory, Inc.IC DRAM 32GBIT LVSTLE 200FBGAMemory200-FBGA (10x15)1.06V ~ 1.17V, 1.7V ~ 1.95V-40°C ~ 95°C (TC)
Access Time:
3.5 ns
Clock Frequency:
4.266 GHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
LVSTLE_06
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-VFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4X
Write Cycle Time Word Page:
18 ns
1,283
AS4C2G16D4-62BCNAS4C2G16D4-62BCNAlliance Memory, Inc.DDR4, 32GB, 2G X 16, 1.2V, 96-BAMemory96-FBGA (7.5x13)1.14V ~ 1.26V0°C ~ 95°C (TC)
Access Time:
13.75 ns
Clock Frequency:
1.6 GHz
Grade:
Extended / Automotive-like
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2G x 16
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
96-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR4
Write Cycle Time Word Page:
N/A
623
AS4C2G16D4-62BCNTRAS4C2G16D4-62BCNTRAlliance Memory, Inc.DDR4, 32GB, 2G X 16, 1.2V, 96-BAMemory96-FBGA (7.5x13)1.14V ~ 1.26V0°C ~ 95°C (TC)
Access Time:
13.75 ns
Clock Frequency:
1.6 GHz
Grade:
Extended / Automotive-like
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2G x 16
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
96-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR4
Write Cycle Time Word Page:
N/A
73
AS4C2M32D1-5BCNAS4C2M32D1-5BCNAlliance Memory, Inc.IC DRAM 64MBIT PARALLEL 144BGAMemory144-LFBGA (12x12)2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2M x 32
Memory Size:
64 Mbit
Memory Type:
Volatile
Packaging:
144-LFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,281
AS4C2M32D1-5BINAS4C2M32D1-5BINAlliance Memory, Inc.IC DRAM 64MBIT PARALLEL 144BGAMemory144-LFBGA (12x12)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2M x 32
Memory Size:
64 Mbit
Memory Type:
Volatile
Packaging:
144-LFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
990
AS4C2M32D1A-5BCNAS4C2M32D1A-5BCNAlliance Memory, Inc.IC DRAM 64MBIT PARALLEL 144LFBGAMemory144-LFBGA (12x12)2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2M x 32
Memory Size:
64 Mbit
Memory Type:
Volatile
Packaging:
144-LFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
967

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