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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MCIMX502EVM8B
MCIMX502EVM8BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
273
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MCIMX503CVM8B
MCIMX503CVM8BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
168
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MCIMX503CVM8BR2
MCIMX503CVM8BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
1,505
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MCIMX507CVK8B
MCIMX507CVK8BNXP SemiconductorsIC MPU I.MX50 800MHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
35
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MCIMX507CVK8BR2
MCIMX507CVK8BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
488
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MCIMX507CVM1B
MCIMX507CVM1BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
534
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MCIMX507CVM1BR2
MCIMX507CVM1BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
829
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MCIMX507CVM8B
MCIMX507CVM8BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
676
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N/A
MCIMX508CVK1BNXP SemiconductorsIC MPU I.MX50 1.0GHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
1,975
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MCIMX508CVK8B
MCIMX508CVK8BNXP SemiconductorsIC MPU I.MX50 800MHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
1,090
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QUOTE
MCIMX508CVK8BR2
MCIMX508CVK8BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
248
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MCIMX508CVM8B
MCIMX508CVM8BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
120
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MCIMX508CVM8BR2
MCIMX508CVM8BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
316
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N/A
MCIMX508CZK8BNXP SemiconductorsIC MPU I.MX50 800MHZ 416VFBGAMicroprocessors416-VFBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-VFBGA
Supplier Device Package:
416-VFBGA (13×13)
471
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MCIMX512CJM6C
MCIMX512CJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
988
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MCIMX512CJM6CR2
MCIMX512CJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
743
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MCIMX512DJM8C
MCIMX512DJM8CNXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
1,039
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MCIMX512DJM8CR2
MCIMX512DJM8CR2NXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)1.2V, 1.875V, 2.775V, 3.0V-20°C – 85°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
931
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MCIMX513CJM6C
MCIMX513CJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
587
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MCIMX513CJM6CR2
MCIMX513CJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)1.2V, 1.875V, 2.775V, 3.0V-40°C – 95°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Mounting Type:
Surface Mount
547
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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