Microprocessors

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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX535DVP2C2MCIMX535DVP2C2NXP SemiconductorsIC MPU I.MX53 1.2GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
170
MCIMX535DVV1BMCIMX535DVV1BNXP SemiconductorsIC MPU I.MX53 1.0GHZ 529FBGAMicroprocessors529-FBGA (19x19)1.3V, 1.8V, 2.775V, 3.3V-20°C – 85°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
110
MCIMX535DVV1CMCIMX535DVV1CNXP SemiconductorsIC MPU I.MX53 1.0GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
30
MCIMX535DVV1C2MCIMX535DVV1C2NXP SemiconductorsIC MPU I.MX53 1GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 70°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
317
MCIMX535DVV1C2R2MCIMX535DVV1C2R2NXP SemiconductorsIC MPU I.MX53 1GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 70°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
34
MCIMX535DVV1CR2MCIMX535DVV1CR2NXP SemiconductorsIC MPU I.MX53 1.0GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
859
MCIMX535DVV2CMCIMX535DVV2CNXP SemiconductorsIC MPU I.MX53 1.2GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
120
MCIMX535DVV2C2MCIMX535DVV2C2NXP SemiconductorsIC MPU I.MX53 1.2GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
48
MCIMX536AVP8C2MCIMX536AVP8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
418
MCIMX536AVP8C2R2MCIMX536AVP8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
570
MCIMX536AVV8BMCIMX536AVV8BNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)1.3V, 1.8V, 2.775V, 3.3V-40°C – 125°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
114
MCIMX536AVV8CMCIMX536AVV8CNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,050
MCIMX536AVV8C2MCIMX536AVV8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,128
MCIMX536AVV8C2R2MCIMX536AVV8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
110
MCIMX537CVP8C2MCIMX537CVP8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
222
MCIMX537CVP8C2R2MCIMX537CVP8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
993
MCIMX537CVV8BMCIMX537CVV8BNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)1.3V, 1.8V, 2.775V, 3.3V-40°C – 85°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
1,097
MCIMX537CVV8CMCIMX537CVV8CNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,713
MCIMX537CVV8C2MCIMX537CVV8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
306
MCIMX537CVV8C2R2MCIMX537CVV8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,166

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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