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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | N/A | MCIMX535DVP2C2 | NXP Semiconductors | IC MPU I.MX53 1.2GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 1,872 | |
 | MCIMX535DVV1B | NXP Semiconductors | IC MPU I.MX53 1.0GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | 1.3V, 1.8V, 2.775V, 3.3V | -20°C – 85°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Mounting Type: Surface Mount | 946 | ||
 | MCIMX535DVV1C | NXP Semiconductors | IC MPU I.MX53 1.0GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 520 | ||
 | N/A | MCIMX535DVV1C2 | NXP Semiconductors | IC MPU I.MX53 1GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 1,247 | |
 | N/A | MCIMX535DVV1C2R2 | NXP Semiconductors | IC MPU I.MX53 1GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 70°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 263 | |
 | MCIMX535DVV1CR2 | NXP Semiconductors | IC MPU I.MX53 1.0GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 544 | ||
 | MCIMX535DVV2C | NXP Semiconductors | IC MPU I.MX53 1.2GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 1,028 | ||
 | MCIMX535DVV2C2 | NXP Semiconductors | IC MPU I.MX53 1.2GHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -20°C ~ 85°C (TC) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 562 | ||
 | N/A | MCIMX536AVP8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 187 | |
 | N/A | MCIMX536AVP8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 1,306 | |
 | MCIMX536AVV8B | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | 1.3V, 1.8V, 2.775V, 3.3V | -40°C – 125°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Mounting Type: Surface Mount | 173 | ||
 | MCIMX536AVV8C | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 1,216 | ||
 | N/A | MCIMX536AVV8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 24 | |
 | N/A | MCIMX536AVV8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 954 | |
 | N/A | MCIMX537CVP8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 870 | |
 | N/A | MCIMX537CVP8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 786 | |
 | MCIMX537CVV8B | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | 1.3V, 1.8V, 2.775V, 3.3V | -40°C – 85°C | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Mounting Type: Surface Mount | 47 | ||
 | MCIMX537CVV8C | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 824 | ||
 | N/A | MCIMX537CVV8C2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 4 | |
 | N/A | MCIMX537CVV8C2R2 | NXP Semiconductors | IC MPU I.MX53 800MHZ 529FBGA | Microprocessors | 529-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage – I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19×19) Additional Interfaces: 1-Wire, AC’97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | 1,647 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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