Microprocessors

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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX513DJM8CMCIMX513DJM8CNXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
637
MCIMX513DJM8CR2MCIMX513DJM8CR2NXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)1.2V, 1.875V, 2.775V, 3.0V-20°C – 85°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
1,049
MCIMX514AJM6CN/AMCIMX514AJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
908
N/AMCIMX514AJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
1,100
MCIMX515CJM6CMCIMX515CJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
541
MCIMX515CJM6CR2MCIMX515CJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
199
MCIMX515DJM8CMCIMX515DJM8CNXP SemiconductorsIC MPU 800MHZ 529BGAMicroprocessors529-BGA Case 2017 (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA Case 2017 (19×19)
926
MCIMX515DJM8CR2MCIMX515DJM8CR2NXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
286
MCIMX515DVK8CMCIMX515DVK8CNXP SemiconductorsIC MPU I.MX51 800MHZ 527BGAMicroprocessors527-BGA (13x13)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
527-LFBGA
Supplier Device Package:
527-BGA (13×13)
1,080
MCIMX516AJM6CMCIMX516AJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
926
MCIMX516AJM6CR2MCIMX516AJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
564
MCIMX534AVP8C2MCIMX534AVP8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
879
MCIMX534AVP8C2R2MCIMX534AVP8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
681
MCIMX534AVV8BMCIMX534AVV8BNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)1.3V, 1.8V, 2.775V, 3.3V-40°C – 125°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
737
MCIMX534AVV8CMCIMX534AVV8CNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
782
MCIMX534AVV8C2MCIMX534AVV8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
743
MCIMX534AVV8C2R2MCIMX534AVV8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
62
MCIMX534AVV8CR2MCIMX534AVV8CR2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,095
MCIMX535DVP1C2MCIMX535DVP1C2NXP SemiconductorsIC MPU I.MX53 1GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,286
MCIMX535DVP1C2R2MCIMX535DVP1C2R2NXP SemiconductorsIC MPU I.MX53 1GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
744

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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