Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
OMAP3515ECBBAOMAP3515ECBBATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Industrial
430
OMAP3515ECUSOMAP3515ECUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
702
OMAP3515ECUS72OMAP3515ECUS72Texas InstrumentsIC MPU OMAP-35XX 720MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
991
OMAP3515ECUSAOMAP3515ECUSATexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Industrial
1,044
OMAP3525DCBCAOMAP3525DCBCATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Industrial
27
OMAP3525DCUSOMAP3525DCUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
327
OMAP3525ECBBOMAP3525ECBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
604
OMAP3525ECBBAOMAP3525ECBBATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Industrial
378
OMAP3525ECBCOMAP3525ECBCTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Commercial
659
OMAP3525ECUSOMAP3525ECUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
172
OMAP3525ECUSAOMAP3525ECUSATexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Industrial
203
OMAP3530DCBBOMAP3530DCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
286
OMAP3530DCBB72OMAP3530DCBB72Texas InstrumentsIC MPU OMAP-35XX 720MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
736
OMAP3530DCBBAOMAP3530DCBBATexas InstrumentsIC MPU OMAP-35XX 720MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Industrial
116
OMAP3530DCBCOMAP3530DCBCTexas InstrumentsIC MPU OMAP-35XX 720MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Commercial
770
OMAP3530DCBC72OMAP3530DCBC72Texas InstrumentsIC MPU OMAP-35XX 720MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Commercial
423
OMAP3530DCBCAOMAP3530DCBCATexas InstrumentsIC MPU OMAP-35XX 720MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Industrial
1,233
OMAP3530DCUSOMAP3530DCUSTexas InstrumentsIC MPU OMAP-35XX 720MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
1,208
OMAP3530DCUS72OMAP3530DCUS72Texas InstrumentsIC MPU OMAP-35XX 720MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
349
OMAP3530DCUSAOMAP3530DCUSATexas InstrumentsIC MPU OMAP-35XX 720MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Industrial
1,171

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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