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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | TS68040VR33A | Microchip Technology | IC MPU 25MHZ 179PGA | Microprocessors | 179-PGA (47.24x47.24) | N/A | -40°C ~ 110°C (TC) | Core Processor: 68000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Through Hole Package / Case: 179-PGA Supplier Device Package: 179-PGA (47.24×47.24) | 924 | ||
| N/A | TS68C000VC10A | Microchip Technology | IC MPU 10MHZ 64DIL | Microprocessors | 64-DIL | N/A | -40°C ~ 85°C (TC) | Core Processor: 68000 Number of Cores/Bus Width: 1 Core, 16/32-Bit Speed: 10MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Through Hole Package / Case: 64-CDIP (0.900″, 22.86mm) Supplier Device Package: 64-DIL | 1,878 | ||
| N/A | TS68C000VC12A | Microchip Technology | IC MPU 12MHZ 64DIL | Microprocessors | 64-DIL | N/A | -40°C ~ 85°C (TC) | Core Processor: 68000 Number of Cores/Bus Width: 1 Core, 16/32-Bit Speed: 12MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Through Hole Package / Case: 64-CDIP (0.900″, 22.86mm) Supplier Device Package: 64-DIL | 642 | ||
| N/A | TS68C000VC8A | Microchip Technology | IC MPU 8MHZ 64DIL | Microprocessors | 64-DIL | N/A | -40°C ~ 85°C (TC) | Core Processor: 68000 Number of Cores/Bus Width: 1 Core, 16/32-Bit Speed: 8MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Through Hole Package / Case: 64-CDIP (0.900″, 22.86mm) Supplier Device Package: 64-DIL | 543 | ||
| N/A | TS68C000VR10A | Microchip Technology | IC MPU 10MHZ 68CPGA | Microprocessors | 68-CPGA (26.92x26.92) | N/A | -40°C ~ 85°C (TC) | Core Processor: 68000 Number of Cores/Bus Width: 1 Core, 16/32-Bit Speed: 10MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Through Hole Package / Case: 68-BCPGA Supplier Device Package: 68-CPGA (26.92×26.92) | 309 | ||
| N/A | TS68C000VR12A | Microchip Technology | IC MPU 12MHZ 68CPGA | Microprocessors | 68-CPGA (26.92x26.92) | N/A | -40°C ~ 85°C (TC) | Core Processor: 68000 Number of Cores/Bus Width: 1 Core, 16/32-Bit Speed: 12MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Through Hole Package / Case: 68-BCPGA Supplier Device Package: 68-CPGA (26.92×26.92) | 12 | ||
| N/A | TS68C000VR8A | Microchip Technology | IC MPU 8MHZ 68CPGA | Microprocessors | 68-CPGA (26.92x26.92) | N/A | -40°C ~ 85°C (TC) | Core Processor: 68000 Number of Cores/Bus Width: 1 Core, 16/32-Bit Speed: 8MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Through Hole Package / Case: 68-BCPGA Supplier Device Package: 68-CPGA (26.92×26.92) | 485 | ||
 | TS68EN360VA25L | Microchip Technology | IC MPU 25MHZ 240CERQUAD | Microprocessors | 240-CERQUAD (31x31) | N/A | -40°C ~ 85°C (TC) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 240-BFCQFP Supplier Device Package: 240-CERQUAD (31×31) Additional Interfaces: SCC, SMC, SPI | 355 | ||
 | TS68EN360VA33L | Microchip Technology | IC MPU 33MHZ 240CERQUAD | Microprocessors | 240-CERQUAD (31x31) | N/A | -40°C ~ 85°C (TC) | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 240-BFCQFP Supplier Device Package: 240-CERQUAD (31×31) Additional Interfaces: SCC, SMC, SPI | 938 | ||
 | TS80L188EC13 | Intel | IC MPU I186 13MHZ 100SQFP | Microprocessors | 100-SQFP | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 13MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-QFP Supplier Device Package: 100-SQFP | 637 | ||
 | TSPC603RVA8LC | Microchip Technology | IC MPU 200MHZ 240CERQUAD | Microprocessors | 240-CERQUAD (31x31) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 240-BFCQFP Supplier Device Package: 240-CERQUAD (31×31) | 1,989 | ||
| N/A | TSPC603RVGH10LC | Microchip Technology | IC MPU 603E 233MHZ 255CBGA | Microprocessors | 255-HiTCE-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 233MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-HiTCE-CBGA (21×21) | 806 | ||
| N/A | TSPC603RVGH12LC | Microchip Technology | IC MPU 603E 266MHZ 255CBGA | Microprocessors | 255-HiTCE-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-HiTCE-CBGA (21×21) | 178 | ||
| N/A | TSPC603RVGH8LC | Microchip Technology | IC MPU 603E 200MHZ 255CBGA | Microprocessors | 255-HiTCE-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-HiTCE-CBGA (21×21) | 966 | ||
| N/A | TSPC603RVGS10LC | Microchip Technology | IC MPU 603E 233MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 233MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 669 | ||
| N/A | TSPC603RVGS12LC | Microchip Technology | IC MPU 603E 266MHZ 255CICBGA | Microprocessors | 255-CI-CGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCGA Supplier Device Package: 255-CI-CGA (21×21) | 1,081 | ||
| N/A | TSPC603RVGS6LC | Microchip Technology | IC MPU 603E 166MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 166MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 539 | ||
| N/A | TSPC603RVGS8LC | Microchip Technology | IC MPU 603E 200MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 990 | ||
| N/A | TSPC603RVGU10LC | Microchip Technology | IC MPU 233MHZ 255CBGA | Microprocessors | 255-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 233MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CBGA (21×21) | 29 | ||
| N/A | TSPC603RVGU12LC | Microchip Technology | IC MPU 266MHZ 255CBGA | Microprocessors | 255-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CBGA (21×21) | 1,260 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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