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Total Products: 3,238
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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KMPC8265ACVVMIBC
KMPC8265ACVVMIBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,163
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KMPC8265ACZUMIBC
KMPC8265ACZUMIBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
536
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KMPC8265AZUPJDC
KMPC8265AZUPJDCNXP SemiconductorsIC MPU MPC82XX 300MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
877
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KMPC8270CVRMIBA
KMPC8270CVRMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
849
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KMPC8270CVVQLDA
KMPC8270CVVQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
462
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KMPC8270CVVUPEA
KMPC8270CVVUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,399
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KMPC8270CZQMIBA
KMPC8270CZQMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
956
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KMPC8270CZUQLDA
KMPC8270CZUQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,729
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QUOTE
KMPC8270CZUUPEA
KMPC8270CZUUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
295
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KMPC8270VRMIBA
KMPC8270VRMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,521
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QUOTE
KMPC8270VVUPEA
KMPC8270VVUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
892
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QUOTE
KMPC8270ZQMIBA
KMPC8270ZQMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
425
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QUOTE
KMPC8270ZUUPEA
KMPC8270ZUUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,058
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QUOTE
KMPC8271CVRTIEA
KMPC8271CVRTIEANXP SemiconductorsIC MPU MPC82XX 400MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,001
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QUOTE
KMPC8271VRTIEA
KMPC8271VRTIEANXP SemiconductorsIC MPU MPC82XX 400MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,950
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QUOTE
KMPC8272CVRTIEA
KMPC8272CVRTIEANXP SemiconductorsIC MPU MPC82XX 400MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; RISC CPM, Security; SEC
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
517
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QUOTE
KMPC8272VRTIEA
KMPC8272VRTIEANXP SemiconductorsIC MPU MPC82XX 400MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; RISC CPM, Security; SEC
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,560
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QUOTE
KMPC8272VRTMFA
KMPC8272VRTMFANXP SemiconductorsIC MPU MPC82XX 400MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; RISC CPM, Security; SEC
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
997
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QUOTE
KMPC8275CVRMIBA
KMPC8275CVRMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
436
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QUOTE
KMPC8275CZQMIBA
KMPC8275CZQMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
35
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