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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCE360CZQ25LR2N/AMCE360CZQ25LR2NXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)5.0V-40°C – 85°C
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Mounting Type:
Surface Mount
295
MCF5206AB25AMCF5206AB25ANXP SemiconductorsIC MPU MCF520X 25MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
657
MCF5206AB33AMCF5206AB33ANXP SemiconductorsIC MPU MCF520X 33MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
RAM Controllers:
DRAM
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
251
MCF5206EAB40MCF5206EAB40NXP SemiconductorsIC MPU MCF520X 40MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
196
MCF5206EAB54MCF5206EAB54NXP SemiconductorsIC MPU MCF520X 54MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
54MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
568
MCF5206ECAB40MCF5206ECAB40NXP SemiconductorsIC MPU MCF520X 40MHZ 160QFPMicroprocessors160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
103
MCF5206ECFT40MCF5206ECFT40NXP SemiconductorsIC MPU MCF520X 40MHZ 160QFPMicroprocessors160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
390
MCF5206EFT40MCF5206EFT40NXP SemiconductorsIC MPU MCF520X 40MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
658
MCF5206EFT54MCF5206EFT54NXP SemiconductorsIC MPU MCF520X 54MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
54MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
555
MCF5206FT16AMCF5206FT16ANXP SemiconductorsIC MPU MCF520X 16MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
1,001
MCF5206FT33AMCF5206FT33ANXP SemiconductorsIC MPU MCF520X 33MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
RAM Controllers:
DRAM
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
Additional Interfaces:
EBI/EMI, I2C, UART/USART
181
MCF5233CVM100MCF5233CVM100NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicroprocessors256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
244
MCIMX233CAG4BMCIMX233CAG4BNXP SemiconductorsIC MPU I.MX23 454MHZ 128LQFPMicroprocessors128-LQFP (14x14)2.0V, 2.5V, 2.7V, 3.0V, 3.3V-40°C – 85°C
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Mounting Type:
Surface Mount
437
MCIMX233CAG4CMCIMX233CAG4CNXP SemiconductorsIC MPU I.MX23 454MHZ 128LQFPMicroprocessors128-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
Supplier Device Package:
128-LQFP (14×14)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
373
MCIMX233CJM4CMCIMX233CJM4CNXP SemiconductorsIC MPU I.MX23 454MHZ 169MAPBGAMicroprocessors169-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
169-LFBGA
Supplier Device Package:
169-MAPBGA (11×11)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
1,059
MCIMX233CJM4CR2MCIMX233CJM4CR2NXP SemiconductorsIC MPU I.MX23 454MHZ 169MAPBGAMicroprocessors169-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
169-LFBGA
Supplier Device Package:
169-MAPBGA (11×11)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
471
MCIMX233DAG4BMCIMX233DAG4BNXP SemiconductorsIC MPU I.MX23 454MHZ 128LQFPMicroprocessors128-LQFP (14x14)2.0V, 2.5V, 2.7V, 3.0V, 3.3V-10°C – 70°C
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Mounting Type:
Surface Mount
1,000
MCIMX233DAG4CMCIMX233DAG4CNXP SemiconductorsIC MPU I.MX23 454MHZ 128LQFPMicroprocessors128-LQFP (14x14)N/A-10°C ~ 70°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-10°C ~ 70°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
Supplier Device Package:
128-LQFP (14×14)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
61
MCIMX233DJM4BMCIMX233DJM4BNXP SemiconductorsIC MPU I.MX23 454MHZ 169MAPBGAMicroprocessors169-MAPBGA (11x11)N/A-10°C ~ 70°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-10°C ~ 70°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
169-LFBGA
Supplier Device Package:
169-MAPBGA (11×11)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
66
MCIMX233DJM4BR2MCIMX233DJM4BR2NXP SemiconductorsIC MPU I.MX23 454MHZ 169MAPBGAMicroprocessors169-MAPBGA (11x11)N/A-10°C ~ 70°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
454MHz
Co-Processors/DSP:
Data; DCP
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature:
-10°C ~ 70°C (TA)
Security Features:
Cryptography, Hardware ID
Mounting Type:
Surface Mount
Package / Case:
169-LFBGA
Supplier Device Package:
169-MAPBGA (11×11)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
1,377

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