 | | AGLN010V5-UCG36I | Microchip Technology | IC FPGA 23 I/O 36UCSP | FPGAs | 36-UCSP (3x3) | 1.425 V - 1.575 V | -40°C – 100°C | Number of Logic Elements/Cells: 260 | 669 | |
 | | AGLN015V2-QNG68 | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.14V ~ 1.575V | -20°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 384 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 30 | |
 | | AGLN015V2-QNG68I | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 384 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 452 | |
 | | AGLN015V5-QNG68 | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.425V ~ 1.575V | -20°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 384 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 833 | |
 | | AGLN015V5-QNG68I | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.425V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 384 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 340 | |
 | | AGLN020V2-CSG81 | Microchip Technology | IC FPGA 52 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.14 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 520 | 1,483 | |
 | | AGLN020V2-CSG81I | Microchip Technology | IC FPGA 52 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 520 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 81-WFBGA, CSBGA Supplier Device Package: 81-CSP (5×5) | 1,337 | |
 | | AGLN020V2-QNG68 | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.14 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 520 | 1,222 | |
 | | AGLN020V2-QNG68I | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.14 V - 1.575 V | -40°C – 100°C | Number of Logic Elements/Cells: 520 | 824 | |
 | | AGLN020V5-CSG81 | Microchip Technology | IC FPGA 52 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.425 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 520 | 330 | |
 | | AGLN020V5-CSG81I | Microchip Technology | IC FPGA 52 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.425 V - 1.575 V | -40°C – 100°C | Number of Logic Elements/Cells: 520 | 1,219 | |
 | | AGLN020V5-QNG68 | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.425V ~ 1.575V | -20°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 520 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 347 | |
 | | AGLN020V5-QNG68I | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.425V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 520 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 1,887 | |
 | | AGLN030V2-ZCSG81 | Microchip Technology | IC FPGA 66 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.14 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 768 | 207 | |
 | | AGLN030V2-ZCSG81I | Microchip Technology | IC FPGA 66 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 768 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 81-WFBGA, CSBGA Supplier Device Package: 81-CSP (5×5) | 1,043 | |
 | | AGLN030V2-ZUCG81 | Microchip Technology | IC FPGA 66 I/O 81UCSP | FPGAs | 81-UCSP (4x4) | 1.14 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 768 | 715 | |
 | | AGLN030V2-ZUCG81I | Microchip Technology | IC FPGA 66 I/O 81UCSP | FPGAs | 81-UCSP (4x4) | 1.14 V - 1.575 V | -40°C – 100°C | Number of Logic Elements/Cells: 768 | 126 | |
 | | AGLN030V5-ZCSG81 | Microchip Technology | IC FPGA 66 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.425 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 768 | 933 | |
 | | AGLN030V5-ZCSG81I | Microchip Technology | IC FPGA 66 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.425V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 768 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 81-WFBGA, CSBGA Supplier Device Package: 81-CSP (5×5) | 880 | |
 | | AGLN030V5-ZUCG81 | Microchip Technology | IC FPGA 66 I/O 81UCSP | FPGAs | 81-UCSP (4x4) | 1.425V ~ 1.575V | -20°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 768 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TJ) Package / Case: 81-WFBGA, CSBGA Supplier Device Package: 81-UCSP (4×4) | 1,916 | |