 | | W74M12JVSSIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O, QPI Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: 3 ms | 488 | |
 | | W74M12JWSSIQ | Winbond Electronics | IC FLASH 128MBIT 104MHZ 8SOIC | Memory | 8-SOIC | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 1,278 | |
 | | W74M12JWSSIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 273 | |
 | | W74M12JWZEIQ | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 1,041 | |
 | | W74M12JWZEIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 1,119 | |
 | | W74M12JWZPIQ | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8WSON | Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 1,473 | |
 | | W74M12JWZPIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8WSON | Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 1,064 | |
 | | W74M25JVSFIQ | Winbond Electronics | IC FLASH 256MBIT SPI/QUAD 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O, QPI, DTR Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Write Cycle Time Word Page: N/A | 1,247 | |
 | | W74M25JVSFIQ TR | Winbond Electronics | IC FLASH 256MBIT SPI/QUAD 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O, QPI, DTR Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Write Cycle Time Word Page: N/A | 475 | |
 | | W74M25JVZEIQ | Winbond Electronics | IC FLASH 256MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O, QPI, DTR Memory Organization: 32M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 368 | |
 | | W74M25JVZEIQ TR | Winbond Electronics | IC FLASH 256MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O, QPI, DTR Memory Organization: 32M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 483 | |
 | | W74M25JWZEIQ | Winbond Electronics | IC FLASH 256MBIT 104MHZ 8WSON | Memory | 8-WSON (8x6) | 1.7V ~ 1.95V | -40°C ~ 85°C | Memory Organization: 32M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 341 | |
 | | W74M25JWZEIQ TR | Winbond Electronics | IC FLASH 256MBIT 104MHZ 8WSON | Memory | 8-WSON (8x6) | 1.7V ~ 1.95V | -40°C ~ 85°C | Memory Organization: 32M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 186 | |
 | | W74M25JWZPIQ | Winbond Electronics | IC FLASH 256MBIT 104MHZ 8WSON | Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C | Memory Organization: 32M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 1,445 | |
 | | W74M25JWZPIQ TR | Winbond Electronics | IC FLASH 256MBIT 104MHZ 8WSON | Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C | Memory Organization: 32M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 422 | |
 | | W74M64FVSSIQ | Winbond Electronics | IC FLASH 64MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 8M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 1,067 | |
 | | W74M64FVSSIQ TR | Winbond Electronics | IC FLASH 64MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 8M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 980 | |
 | | W74M64JVSSIQ | Winbond Electronics | IC FLASH 64MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 8M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 1,273 | |
 | | W74M64JVSSIQ TR | Winbond Electronics | IC FLASH 64MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 8M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 569 | |
 | | W9412G6IH-5 | Winbond Electronics | IC DRAM 128MBIT SSTL2 66TSOP II | Memory | 66-TSOP II | 2.3V ~ 2.7V | 0°C ~ 70°C (TA) | Memory Organization: 8M x 16 Packaging: 66-TSSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: 15 ns | 950 | |