 | N/A | VSC8221XHH | Microchip Technology | IC TRANSCEIVER 1/1 100TFBGA | Drivers, Receivers, Transceivers | 100-TFBGA (9x9) | 3V ~ 3.6V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 3V ~ 3.6V Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 917 | |
 | | VSC8224XHG | Microchip Technology | IC TRANSCEIVER 4/4 260PBGA | Drivers, Receivers, Transceivers | 260-PBGA | 3V ~ 3.6V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 4/4 Voltage – Supply: 3V ~ 3.6V Mounting Type: Surface Mount Supplier Device Package: 260-PBGA | 284 | |
 | | VSC8244XHG | Microchip Technology | IC TRANSCEIVER 4/4 260PBGA | Drivers, Receivers, Transceivers | 260-PBGA | 3V ~ 3.6V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 4/4 Voltage – Supply: 3V ~ 3.6V Mounting Type: Surface Mount Supplier Device Package: 260-PBGA | 537 | |
 | | VSC8538XHJ | Microchip Technology | IC TRANSCEIVER 1/1 444HSBGA | Drivers, Receivers, Transceivers | 444-HSBGA | 1.8V, 2.5V, 3.3V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 444-BGA Exposed Pad Supplier Device Package: 444-HSBGA | 307 | |
 | | VSC8601XKN | Microchip Technology | IC TRANSCEIVER FULL 1/1 64LQFP | Drivers, Receivers, Transceivers | 64-LQFP-EP (10x10) | 2.5V, 3.3V | 0°C ~ 90°C | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP-EP (10×10) | 796 | |
 | | VSC8641XJF | Microchip Technology | IC TRANSCEIVER FULL 1/1 88QFN | Drivers, Receivers, Transceivers | 88-QFN (10x10) | 2.5V, 3.3V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 88-VFQFN Exposed Pad Supplier Device Package: 88-QFN (10×10) | 280 | |
 | | VSC8641XKO | Microchip Technology | IC TRANSCEIVER FULL 1/1 100LQFP | Drivers, Receivers, Transceivers | 100-LQFP | 2.5V, 3.3V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 2.5V, 3.3V Mounting Type: Surface Mount Supplier Device Package: 100-LQFP | 520 | |
| N/A | | VSC8641XKO-03 | Microchip Technology | IC INTERFACE CONTROLLER | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 1,382 | |
 | | W25N512GVBIG | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 602 | |
 | | W25N512GVBIG TR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 4 | |
 | | W25N512GVBIR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 949 | |
 | | W25N512GVBIT | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 102 | |
 | | W25N512GVBIT TR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 208 | |
 | | W25N512GVEIG | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 624 | |
 | | W25N512GVEIG TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 527 | |
 | | W25N512GVEIR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 510 | |
 | | W25N512GVEIR TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 385 | |
 | | W25N512GVEIT | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 741 | |
 | | W25N512GVEIT TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 832 | |
 | | W25N512GVFIG | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Flash Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,031 | |