W25N512GWBIR TR
| Part Description |
IC FLASH 512MBIT SPI 24TFBGA |
|---|---|
| Quantity | 21 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 24-TFBGA (6x8) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 7 ns | Grade | Industrial | ||
| Clock Frequency | 104 MHz | Voltage | 1.7V ~ 1.95V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 700 μs | Packaging | 24-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Quad I/O | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of W25N512GWBIR TR – IC FLASH 512MBIT SPI 24TFBGA
The W25N512GWBIR TR is a 1.8V, 512‑Mbit serial SLC NAND flash memory device from Winbond's SpiFlash® family. It implements Dual/Quad SPI with buffer read and continuous read modes and is organized as 64M × 8 for non‑volatile data storage.
Designed for space‑constrained embedded systems, the device delivers quad I/O serial access, on‑die management features and a compact 24‑TFBGA (6×8) package for low‑voltage 1.8V applications operating from −40°C to 85°C.
Key Features
- Memory Architecture SLC NAND flash technology, 512 Mbit capacity organized as 64M × 8 for byte‑wide serial access.
- Serial Interface SPI interface with Quad I/O support and Dual/Quad SPI instruction sets for higher throughput.
- Read Modes Buffer read and continuous read modes to support efficient sequential data retrieval.
- Performance Clock frequency up to 104 MHz with an access time of 7 ns and a write cycle time (word/page) of 700 µs.
- Power Low‑voltage operation with a supply range of 1.7 V to 1.95 V (nominal 1.8 V).
- Package 24‑TFBGA package (6×8) in a compact surface‑mount form factor.
- Temperature Range Operating ambient temperature from −40°C to 85°C (TA).
- On‑die Management Built‑in protection and configuration registers, bad block management instructions and ECC status reporting to support memory management and error visibility.
Typical Applications
- Embedded storage for 1.8V systems Provides non‑volatile program and data storage where 1.8V supply operation and a small package are required.
- Firmware and code memory Serial SLC NAND in a Quad SPI interface supports storage and execution of firmware images in resource‑constrained designs.
- Sequential data logging Buffer and continuous read modes enable efficient retrieval of stored data in embedded logging or measurement systems.
Unique Advantages
- High‑density in a compact package: 512 Mbit capacity in a 24‑TFBGA (6×8) package reduces board area while providing ample non‑volatile storage.
- Flexible, high‑speed SPI interface: Dual/Quad SPI and a 104 MHz clock option enable faster serial transfers compared with single‑I/O SPI implementations.
- Low‑voltage operation: 1.7 V to 1.95 V supply range supports 1.8V platform compatibility and lower system power rails.
- On‑die management and visibility: Protection/configuration registers, bad block management and ECC status bits assist in managing memory health and reliability.
- Efficient sequential access: Buffer read and continuous read modes improve throughput for streaming and sequential read patterns.
- Wide operating temperature: −40°C to 85°C support for a broad range of ambient environments.
Why Choose W25N512GWBIR TR?
The W25N512GWBIR TR combines 512 Mbit SLC NAND density with Dual/Quad SPI flexibility and on‑die management features, packaged in a compact 24‑TFBGA footprint. Its low‑voltage 1.7–1.95 V operation, high clock capability and read‑optimized modes make it suitable for embedded designs that require serial non‑volatile storage with control over block management and ECC reporting.
As a member of the Winbond SpiFlash® series, the device targets designs needing a balance of density, interface speed and compact packaging while providing register‑level controls for protection and memory management.
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