W25N512GVPIT TR
| Part Description |
IC FLASH 512MBIT SPI/QUAD 8WSON |
|---|---|
| Quantity | 1,108 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 8-WSON (6x5) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 6 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 700 μs | Packaging | 8-WDFN Exposed Pad | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Quad I/O | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of W25N512GVPIT TR – IC FLASH 512MBIT SPI/QUAD 8WSON
The W25N512GVPIT TR is a 3V, 512‑Mbit serial SLC NAND flash memory device from Winbond’s SpiFlash® family providing Dual/Quad SPI with buffer read and continuous read modes. It implements a 64M x 8 memory organization and supports serial Quad I/O for high‑throughput serial flash access.
This device is intended for systems that require non‑volatile serial storage with flexible SPI interfaces and SLC NAND technology, offering a balance of density, performance and board‑level integration for embedded firmware and data storage applications.
Key Features
- Memory Technology Non‑volatile SLC NAND flash memory with a 512 Mbit capacity and 64M x 8 organization.
- Serial Interface Supports SPI with Dual and Quad I/O modes for higher throughput and compatibility with standard serial flash controllers.
- Buffer & Continuous Read Buffer read and continuous read modes are supported to optimize sustained read performance.
- Performance Up to 166 MHz clock frequency and 6 ns access time for responsive read access over the serial interface.
- Program / Erase Timing Typical word/page program cycle time specified at 700 µs.
- Voltage & Temperature Operates from 2.7 V to 3.6 V with an ambient operating temperature range of -40 °C to 85 °C (TA).
- Package Supplied in an 8‑lead WSON (6 × 5 mm) / 8‑WDFN exposed pad package for compact PCB integration and thermal conduction.
- Device Management & Protection Implements protection, configuration and status registers including block protect bits, write protection enable and status registers as detailed in the device instruction set.
Typical Applications
- Firmware and Code Storage Non‑volatile storage for boot code, firmware images and system configuration in embedded designs.
- Embedded Data Storage Compact serial storage for user data or calibration tables in embedded systems that use SPI interfaces.
- Consumer and Industrial Electronics Applicable where a mid‑density SLC NAND serial flash is required with industrial temperature range support.
Unique Advantages
- 512 Mbit SLC Density: Provides a substantial serial flash capacity (64M x 8) for firmware, file systems or data logging without moving to parallel NOR/NAND solutions.
- Flexible SPI Modes: Dual and Quad SPI support with buffer/continuous read modes enables higher effective throughput on compatible hosts.
- Wide Voltage Range: 2.7 V to 3.6 V operation fits common 3V system rails for broad design compatibility.
- Industrial Temperature Range: Rated for -40 °C to 85 °C ambient operation for deployment in temperature‑varied environments.
- Compact Package: 8‑WSON (6 × 5 mm) exposed pad package minimizes PCB area while providing thermal conduction for board‑level designs.
- Integrated Management Features: On‑device protection and status/configuration registers (including ECC status and block management functions) simplify reliability and maintenance tasks.
Why Choose W25N512GVPIT TR?
The W25N512GVPIT TR combines 512 Mbit SLC NAND capacity with Dual/Quad SPI and buffer/continuous read modes to deliver a flexible serial flash solution for embedded designs that need moderate capacity and reliable non‑volatile storage. Its specified operating voltage range and -40 °C to 85 °C rating make it suitable for a wide range of board‑level applications.
This device is well suited to designers seeking a compact, serial SLC NAND flash with explicit command, protection and status register support documented in the Winbond specification set, enabling predictable integration into firmware storage and data retention roles.
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