 | | W25N512GWPIT TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 702 | |
 | | W25N512GWYIR TR | Winbond Electronics | IC FLASH 512MBIT SPI 48WLCSP | Memory | 48-WLCSP | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 48-UFBGA, WLCSP Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 256 | |
 | | W25N512GWYIT TR | Winbond Electronics | IC FLASH 512MBIT SPI 48WLCSP | Memory | 48-WLCSP | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 48-UFBGA, WLCSP Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 502 | |
 | | W25X64VSFIG | Winbond Electronics | IC FLASH 64MBIT SPI 75MHZ 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 8M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Write Cycle Time Word Page: 3 ms | 368 | |
 | | W25X64VZEIG | Winbond Electronics | IC FLASH 64MBIT SPI 75MHZ 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 8M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: 3 ms | 1,367 | |
 | | W35T25NWSFIE | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 108 | |
 | | W35T25NWSFIE TR | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 297 | |
 | | W35T25NWSFIF | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 978 | |
 | | W35T25NWSFIF TR | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 1,338 | |
| N/A | | W35T25NWTBIE | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 1,266 | |
| N/A | | W35T25NWTBIF | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 1,030 | |
| N/A | | W35T51NWTBIE | Winbond Electronics | OCTALFLASH, 512M-BIT, 4KB UNIFOR | Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 605 | |
| N/A | | W35T51NWTBIE TR | Winbond Electronics | OCTALFLASH, 512M-BIT, 4KB UNIFOR | Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 1,652 | |
| N/A | | W35T51NWTBIF | Winbond Electronics | OCTAL FLASH, 1.8V, 512M-BIT | Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 129 | |
| N/A | | W35T51NWTBIF TR | Winbond Electronics | OCTAL FLASH, 1.8V, 512M-BIT | Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 771 | |
 | | W74M12FVSSIQ | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 1,472 | |
 | | W74M12FVSSIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 647 | |
 | | W74M12FVZPIQ | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8WSON | Memory | 8-WSON (6x5) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 802 | |
 | | W74M12FVZPIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8WSON | Memory | 8-WSON (6x5) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 736 | |
 | | W74M12JVSSIQ | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O, QPI Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: 3 ms | 313 | |