W35T25NWTBIE

The W35T25NWTBIE is a 256 Mbit non-volatile flash memory organized as 32M × 8, implemented with FLASH - NAND (SLC) technology and accessed via an SPI Octal I/O interface. It operates from a 1.65 V to 2.0 V supply and is supplied in a compact 24-TFBGA (8×6) package.

This device targets applications that require high-density serial flash at 1.8 V systems, offering a 200 MHz clock frequency, 4.5 ns access time and a 1.5 ms word/page write cycle time for program operations. The device is specified for an operating ambient range of -40°C to 85°C.

Key Features

• Memory Type & Organization 256 Mbit FLASH (NAND SLC), organized as 32M × 8 for high-density code and data storage.
• Interface SPI – Octal I/O interface to support multi-bit serial transfers.
• Performance 200 MHz clock frequency and 4.5 ns access time to support fast data transfer and low-latency reads.
• Program/Write Timing 1.5 ms write cycle time per word/page for programming operations.
• Power Low-voltage operation from 1.65 V to 2.0 V for compatibility with 1.8 V system rails.
• Package & Mounting Compact 24-TFBGA (8×6) package suitable for space-constrained board designs.
• Operating Temperature Specified for -40°C to 85°C (TA), supporting industrial ambient ranges.

Typical Applications

• Consumer Electronics Storage for firmware and assets in devices such as Bluetooth accessories, true wireless stereo (TWS), smart home devices, musical instruments and game devices.
• Networking & Connectivity Flash storage for 5G, Wi‑Fi, xDSL and GPON modules where serial high-density non-volatile memory is required.
• Imaging & Surveillance Code and configuration storage for surveillance cameras and related edge devices.
• Embedded Systems & Peripherals Firmware and data storage for PC peripherals, printers, and other embedded controller applications.

Unique Advantages

• High-density serial storage: 256 Mbit capacity in a 32M × 8 organization provides ample non-volatile space for code and data.
• Octal SPI throughput: SPI Octal I/O paired with a 200 MHz clock frequency enables higher serial transfer rates compared with single-bit SPI interfaces.
• Low-voltage compatibility: 1.65 V–2.0 V supply range supports 1.8 V system rails and helps simplify power-rail integration.
• Compact BGA package: 24-TFBGA (8×6) package minimizes PCB footprint for space-constrained designs.
• Fast access and program timing: 4.5 ns access time and 1.5 ms write cycle time for word/page programming support responsive firmware operations.
• Industrial temperature range: Specified -40°C to 85°C for use in a broad set of ambient conditions.

Why Choose W35T25NWTBIE?

The W35T25NWTBIE combines high-density SLC flash memory with an Octal SPI interface and low-voltage operation to address embedded designs that need compact, high-capacity non-volatile storage at 1.8 V system levels. Its performance characteristics — including a 200 MHz clock rating and 4.5 ns access time — support demanding serial transfer requirements while the small 24-TFBGA package helps minimize board area.

Manufactured by Winbond, this product aligns with longevity and supply continuity goals stated by the vendor, making it suitable for designs that require sustained availability and consistent production support.

Request a quote or submit an inquiry for pricing and availability to evaluate W35T25NWTBIE for your design requirements.