W35T25NWSFIE

The W35T25NWSFIE is a 256 Mbit SLC NAND flash memory device from Winbond Electronics' SpiFlash® family, organized as 32M × 8. It implements an Octal I/O SPI interface and operates from a 1.65 V to 2.0 V supply, targeting compact code-storage and embedded non-volatile applications.

Designed for high-throughput serial flash applications, the device combines a high-speed 200 MHz clock capability and a small 16-SOIC package to support space-constrained designs across IoT, 5G and high-performance computing use cases.

Key Features

• Core / Technology  SLC NAND flash technology providing non-volatile storage in a 256 Mbit memory format (32M × 8).
• Memory Organization & Capacity  256 Mbit capacity organized as 32M × 8 for straightforward byte-oriented addressing.
• Performance  Supports up to 200 MHz clock frequency with an access time of 4.5 ns to enable fast serial read operations.
• Interface  SPI - Octal I/O memory interface for higher parallelism on serial bus transfers.
• Write Timing  Word/page write cycle time specified at 1.5 ms for program operations.
• Power  Low-voltage operation from 1.65 V to 2.0 V suitable for 1.8 V-class system architectures.
• Package  Available in a 16-SOIC package (0.295", 7.50 mm width) for compact PCB footprints.
• Temperature Range  Operating ambient range from −40°C to 85°C (TA) for applications requiring extended temperature performance.

Typical Applications

• Code Storage for Embedded Systems  Stores firmware and boot code in a compact 256 Mbit flash with Octal SPI throughput for faster code fetch.
• IoT Devices  Low-voltage operation and a small 16-SOIC package help minimize power and PCB area in connected endpoints.
• 5G and High-Performance Computing  High clock-rate support (200 MHz) and octal I/O enable higher serial transfer rates for system-level code and data storage.
• Industrial Equipment  −40°C to 85°C operating range supports deployment in equipment that requires extended ambient temperature performance.

Unique Advantages

• Octal SPI Throughput: Octal I/O interface combined with up to 200 MHz clock frequency increases serial transfer bandwidth compared to narrower SPI modes.
• SLC NAND Reliability: SLC NAND technology provides a flash memory option with the characteristics defined in the product documentation for code storage use.
• Low-Voltage Compatibility: 1.65 V–2.0 V supply range enables integration into 1.8 V-class system designs to reduce power domain complexity.
• Compact Package: 16-SOIC (7.50 mm width) packaging helps conserve board space in compact or space-constrained layouts.
• Extended Temperature Range: −40°C to 85°C operating range supports deployment across a wide range of environmental conditions.
• Clear Timing Parameters: Documented access time (4.5 ns) and write cycle time (1.5 ms per word/page) simplify performance budgeting in system design.

Why Choose W35T25NWSFIE?

The W35T25NWSFIE positions itself as a compact, low-voltage octal-flash solution for engineers who need 256 Mbit of SLC NAND non-volatile memory with documented timing and thermal characteristics. Its Octal SPI interface and 200 MHz clock capability address designs that require higher serial throughput while preserving a small package footprint.

Backed by Winbond Electronics' code storage product family and quality management practices, this part is suited for designs where clear electrical, timing and environmental specifications are required to manage integration, scalability and long-term supply considerations.

Request a quote or submit an inquiry for pricing and availability to evaluate W35T25NWSFIE for your next design.