W35T25NWSFIE TR

The W35T25NWSFIE TR from Winbond Electronics is a 1.8V, 256 Mbit octal SPI flash memory organized as 32M × 8. It implements an octal I/O SPI interface with DDR options and on-device ECC, delivering high-density non-volatile storage for systems that require fast serial read performance and robust data integrity.

Targeted at embedded and firmware storage applications, the device supports Execute-in-Place (XIP) operation and provides control and status features necessary for integration into performance-sensitive designs operating between -40°C and 85°C.

Key Features

• Memory Core 256 Mbit NAND SLC Flash organized as 32M × 8, non-volatile storage suitable for code and data retention.
• Octal SPI Interface SPI – Octal I/O interface with Octal Double Data Rate (ODDR) and octal SDR modes documented in the device functional descriptions.
• High-Speed Operation Supports clock operation up to 200 MHz and an access time listed at 4.5 ns for fast read responsiveness.
• Data Integrity Built-in ECC operation and CRC features (including CRC-At-Rest and CRC-In-Transit modes) are provided for error detection and correction.
• Execute-in-Place (XIP) XIP mode support and related configuration registers allow direct code execution from flash when enabled.
• Standard Control Pins Pin set includes /CS, CLK, IO0–IO7, /WP, DS (Data Strobe), /RESET, /RSTO, /INT, and /BUSY as described in the pin and functional sections.
• Write and Program Timing Word/page write cycle time specified at 1.5 ms to guide programming and system timing.
• Power and Temperature Low-voltage operation from 1.65V to 2.0V and an operating temperature range of -40°C to 85°C for a variety of embedded environments.
• Package Available in a 16-SOIC (300-mil, 7.50 mm width) package for straightforward PCB mounting and footprint planning.

Typical Applications

• Embedded Code Storage (XIP) Store and execute firmware directly from non-volatile memory using the device's XIP support and octal interface.
• System Firmware and Boot Flash High-density 256 Mbit storage for boot images and system firmware with on-device ECC for integrity during boot.
• High-Throughput Serial Storage Octal I/O and DDR options provide increased serial throughput for applications requiring faster read access.

Unique Advantages

• Octal DDR Interface: Enables higher parallelism on the serial bus for improved read throughput compared to standard SPI modes.
• On-Device ECC and CRC: Integrated error correction and CRC modes enhance data reliability for stored firmware and critical data.
• Low-Voltage Operation: 1.65V–2.0V supply range supports low-voltage system designs and can reduce overall system power budget.
• Execute-in-Place Support: XIP capability allows direct code execution from flash, simplifying memory architecture for embedded systems.
• Compact SOIC Package: 16-SOIC (7.50 mm width) packaging provides a space-efficient footprint for PCB layouts.
• Wide Operating Temperature: -40°C to 85°C rating supports a broad set of industrial and commercial embedded environments.

Why Choose OCTAL FLASH, 1.8V, 256M-BIT?

The W35T25NWSFIE TR combines 256 Mbit SLC NAND flash density with an octal SPI interface and on-device ECC to deliver a balanced solution for embedded designs that demand fast serial reads, integrity checks, and XIP support. Its low-voltage operation and standard 16-SOIC package make it suitable for compact, power-conscious designs.

This device is well suited for designers needing reliable non-volatile code and data storage with enhanced serial throughput and built-in error management. Its documented registers, pin set, and operational modes support integration into systems where long-term robustness and clear configuration control are required.

Request a quote or submit an inquiry to sales for pricing, lead times, and availability for the W35T25NWSFIE TR.