W25X64VSFIG

The W25X64VSFIG is a 64 Mbit serial Flash memory device in Winbond's SpiFlash® family. It implements an SPI memory architecture with an 8M × 8 organization and supports Dual Output SPI and standard SPI command operations for code and data storage.

Designed for systems with constrained board space and pin count, the device is suited for code download applications and for storing voice, text and data, operating from a single 2.7 V to 3.6 V supply and specified for an ambient temperature range of -40°C to 85°C.

Key Features

• Memory Capacity & Organization — 64 Mbit total capacity implemented as an 8M × 8 memory organization for byte-addressable storage.
• SPI Interface & Performance — Standard SPI interface with support for operation up to a 75 MHz clock; also supports Dual Output SPI and Fast Read commands.
• Sector Architecture — Flash architecture with 4 KB sectors (sector erase) and support for page program operations and multiple erase granularities (sector, block, chip).
• Command Set — Implements standard SPI instruction set including Read, Fast Read, Fast Read Dual Output, Page Program, Sector Erase, Block Erase, Chip Erase, JEDEC ID and device identification commands.
• Supply Voltage — Single-supply operation from 2.7 V to 3.6 V for compatibility with common 3.3 V systems.
• Program/Erase Timing — Page program/write cycle timing specified at 3 ms (word/page write cycle).
• Operating Temperature — Specified operation over -40°C to 85°C ambient temperature (TA).
• Package — 16-SOIC (0.295", 7.50 mm width) packaging for throughflow/SMT assembly and common board footprints.

Typical Applications

• Embedded Firmware Storage — Non-volatile code storage and boot code for microcontroller-based systems where SPI and compact package are required.
• Consumer Electronics — Storage of voice, text and user data in compact devices requiring external serial Flash memory.
• Industrial and IoT Devices — External program and data storage for space-constrained control modules operating across a -40°C to 85°C ambient range.

Unique Advantages

• Compact, industry-standard package — 16-SOIC package enables straightforward integration into existing PCB designs with common footprints.
• Flexible SPI command support — Full set of SPI instructions including Dual Output and Fast Read modes to match various read/program workflows.
• Broad supply range — 2.7 V to 3.6 V operation allows use with standard 3.3 V systems without additional power conversion.
• Sized for moderate code and data storage — 64 Mbit capacity with 4 KB sector granularity for manageable erase/program operations.
• Industrial temperature rating — Specified operation from -40°C to 85°C for use in a wide range of environmental conditions.

Why Choose W25X64VSFIG?

The W25X64VSFIG provides a straightforward external Flash option for designs that require 64 Mbit of non-volatile storage with standard SPI compatibility and support for Dual Output and Fast Read modes. Its single-supply 2.7 V–3.6 V operation, 16-SOIC packaging, and -40°C to 85°C operating range make it suitable for embedded, consumer, and industrial applications requiring compact, byte-addressable Flash.

As part of Winbond’s SpiFlash® family, the device offers a predictable instruction set and erase/program operations that integrate into established SPI-based firmware and data storage workflows.

Request a quote or submit an RFQ to obtain pricing and availability for the W25X64VSFIG.