 | | VSC8641XJF | Microchip Technology | IC TRANSCEIVER FULL 1/1 88QFN | Drivers, Receivers, Transceivers | 88-QFN (10x10) | 2.5V, 3.3V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 88-VFQFN Exposed Pad Supplier Device Package: 88-QFN (10×10) | 563 | |
 | | VSC8641XKO | Microchip Technology | IC TRANSCEIVER FULL 1/1 100LQFP | Drivers, Receivers, Transceivers | 100-LQFP | 2.5V, 3.3V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 2.5V, 3.3V Mounting Type: Surface Mount Supplier Device Package: 100-LQFP | 1,084 | |
| N/A | | VSC8641XKO-03 | Microchip Technology | IC INTERFACE CONTROLLER | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 940 | |
 | | W25N512GVBIG | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 455 | |
 | | W25N512GVBIG TR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 526 | |
 | | W25N512GVBIR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,959 | |
 | | W25N512GVBIT | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 401 | |
 | | W25N512GVBIT TR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 261 | |
 | | W25N512GVEIG | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,484 | |
 | | W25N512GVEIG TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,371 | |
 | | W25N512GVEIR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 79 | |
 | | W25N512GVEIR TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 22 | |
 | | W25N512GVEIT | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 26 | |
 | | W25N512GVEIT TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,385 | |
 | | W25N512GVFIG | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 314 | |
 | | W25N512GVFIG TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 27 | |
 | | W25N512GVFIR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,066 | |
 | | W25N512GVFIR TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 219 | |
 | | W25N512GVFIT | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,724 | |
 | | W25N512GVFIT TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 313 | |