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Total Products: 220,361
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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V62/13629-01XEN/AV62/13629-01XETexas InstrumentsENHANCED PRODUCT 16/32 BIT RISCMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
444
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V62/13629-02XEN/AV62/13629-02XETexas InstrumentsENHANCED PRODUCT 16/32 BIT RISCMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
629
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V62/14608-02YE
V62/14608-02YETexas InstrumentsIC MCU 16BIT 256KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-55°C ~ 125°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 14x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
733
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V62/14644-01XEN/AV62/14644-01XETexas InstrumentsMSP430FR5739 24 MHZ ULP MICROCONMicrocontrollers40-VQFN (6x6)N/A-55°C ~ 85°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FRAM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-VQFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
400
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V62/15602-01XF
V62/15602-01XFTexas InstrumentsSITARA PROCESSOR: ARM CORTEX-A8,Microprocessors324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-NFBGA (15×15)
Grade:
Industrial
170
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V62/15608-01XE
V62/15608-01XETexas InstrumentsIC TRANSCEIVER HALF 1/1 8SONDrivers, Receivers, Transceivers8-SON (3x3)3V ~ 3.6V-55°C ~ 125°C
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
80 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-VDFN Exposed Pad
Supplier Device Package:
8-SON (3×3)
1,369
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V62/16627-01XE
V62/16627-01XETexas InstrumentsIC MCU 16BIT 128KB FRAM 64VFQFNMicrocontrollers64-VQFN (9x9)N/A-55°C ~ 95°C (TA)
Core Processor:
CPUXV2
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FRAM
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
193
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V62/17603-01XE
V62/17603-01XETexas InstrumentsIC RECEIVER 0/4 16SOICDrivers, Receivers, Transceivers16-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Receiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
0/4
Receiver Hysteresis:
40 mV
Data Rate:
50Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
607
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V62/18601-01XFN/AV62/18601-01XFTexas InstrumentsC2000 ENHANCED PRODUCT 32-BIT MCMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
I2C, SCI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
204K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
427
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V62/18601-01YE
V62/18601-01YETexas InstrumentsIC MCU 32BIT 1MB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
I2C, SCI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
204K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
456
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V62/18606-01XF
V62/18606-01XFTexas InstrumentsIC MCU 32BIT 4MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
168
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 41x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
525
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V62/18617-01XEN/AV62/18617-01XETexas InstrumentsRADIATION HARDENED 3.3V CAN TRANDrivers, Receivers, Transceivers8-SOIC3V ~ 3.6V-55°C ~ 125°C (TJ)
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
100 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
8
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V62/18617-01XE-TN/AV62/18617-01XE-TTexas InstrumentsRADIATION HARDENED 3.3V CAN TRANDrivers, Receivers, Transceivers8-SOIC3V ~ 3.6V-55°C ~ 125°C (TJ)
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
100 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
585
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N/A
V921YLFRenesasIC RECEIVER 0/2 144TQFPDrivers, Receivers, Transceivers144-TQFP (20x20)1.8V–
Type:
Receiver
Number of Drivers/Receivers:
0/2
Voltage – Supply:
1.8V
Mounting Type:
Surface Mount
Package / Case:
144-TQFP Exposed Pad
Supplier Device Package:
144-TQFP (20×20)
445
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VA80960CA16
VA80960CA16IntelIC MPU I196 16MHZ 168CPGAMicroprocessors168-CPGAN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-CPGA
Supplier Device Package:
168-CPGA
Grade:
Commercial
593
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VA80960CA25
VA80960CA25IntelIC MPU I196 25MHZ 168CPGAMicroprocessors168-CPGAN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-CPGA
Supplier Device Package:
168-CPGA
Grade:
Commercial
152
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N/A
VA80960CF16IntelIC MPU I960 16MHZ 168CPGAMicroprocessors168-CPGA (44.45x44.45)N/A-40°C ~ 110°C (TC)
Core Processor:
Intel® 80960CF
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-BCPGA
Supplier Device Package:
168-CPGA (44.45×44.45)
Grade:
Industrial
1,883
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VA87C196KD20
VA87C196KD20Intel16-BIT, UVPROM, 20MHZMicrocontrollers68-PGA (29.46x29.46)N/A-40°C ~ 105°C (TC)
Core Processor:
MCS 96
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
Serial Port
Peripherals:
PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
EPROM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TC)
Mounting Type:
Through Hole
Supplier Device Package:
68-PGA (29.46×29.46)
Package / Case:
68-BPGA
1,156
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VSC050XKM-01
VSC050XKM-01NXP SemiconductorsVSC050SeriIControlleCMOSControllers64-LQFP (10x10)3V ~ 3.6V-40°C ~ 85°C (TA)
Function:
Controller
Interface:
Serial
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
50mA
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
64-LQFP
Supplier Device Package:
64-LQFP (10×10)
853
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VSC8211XVW
VSC8211XVWMicrochip TechnologyIC TRANSCEIVER 1/1 117LBGADrivers, Receivers, Transceivers117-LBGA (10x14)3V ~ 3.6V–
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
1/1
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Package / Case:
117-LBGA
Supplier Device Package:
117-LBGA (10×14)
883
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