W25N512GVEIR
| Part Description |
IC FLASH 512MBIT SPI/QUAD 8WSON |
|---|---|
| Quantity | 266 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 8-WSON (8x6) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 6 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 700 μs | Packaging | 8-WDFN Exposed Pad | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Quad I/O | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of W25N512GVEIR – IC FLASH 512MBIT SPI/QUAD 8WSON
The W25N512GVEIR is a 3.0V, 512 Mbit serial SLC NAND flash memory device featuring Dual/Quad SPI operation with buffer read and continuous read modes. It provides a 64M × 8 memory organization and a compact 8-WSON (8×6 mm) exposed pad package for space-constrained designs.
Designed for non-volatile storage in embedded systems, the device delivers high-density flash storage with support for Quad I/O, a maximum clock frequency of 166 MHz, and on-die management features suited to firmware, data storage and system code retention where reliable, compact flash is required.
Key Features
- Memory Architecture 512 Mbit SLC NAND flash organized as 64M × 8 for high-density serial non-volatile storage.
- Interface and Modes Serial SPI with Dual and Quad SPI instructions supported; BUF (buffer read) and continuous read modes available per device configuration.
- Performance Up to 166 MHz clock frequency and 6 ns access time for fast read operations; buffer read and continuous read options improve sustained throughput.
- Program/Erase Timing Page/program write cycle time example: 700 µs (word/page), with dedicated program and erase instruction support in the command set.
- Power and Voltage Operates from a 2.7 V to 3.6 V supply range to support common 3V embedded power rails.
- Package and Thermal Supplied in an 8-WSON (8×6 mm) exposed pad package; rated operating temperature range −40°C to 85°C (TA).
- On-Die Management and Protection Includes status/configuration registers, ECC status reporting, bad block management and block protection features as documented in the device instruction set.
Typical Applications
- Firmware and Boot Storage: Non-volatile storage for boot code and firmware images using serial Quad-SPI for fast code fetch.
- Embedded Data Storage: High-density SLC NAND for retention of configuration, logs and application data in embedded systems.
- System Code and Lookup Tables: Storage of large read-only or updateable code/data tables leveraging buffer read and continuous read modes.
Unique Advantages
- High-density SLC NAND: 512 Mbit capacity in a single-chip solution reduces board area compared to multiple lower-density devices.
- Flexible High-speed SPI I/O: Dual/Quad SPI and 166 MHz clock capability enable higher read throughput where supported by the host.
- Compact, Thermal-friendly Package: 8-WSON (8×6 mm) exposed pad package balances small footprint with thermal dissipation for embedded layouts.
- On-chip Management Features: Built-in protection registers, ECC status reporting and bad block management simplify firmware-level flash management and reliability handling.
- Wide Supply Range: 2.7 V to 3.6 V operation supports common 3V system rails for straightforward integration.
Why Choose W25N512GVEIR?
The W25N512GVEIR positions itself as a compact, high-density serial SLC NAND flash device suitable for embedded designs that require reliable non-volatile storage with Dual/Quad SPI support. Its combination of 512 Mbit capacity, high-speed SPI operation up to 166 MHz, on-die management features and a small 8-WSON package makes it appropriate for designs needing substantial read-oriented storage in a small footprint.
This device is suited to engineers and procurement teams seeking a verified SLC NAND flash component with documented instruction sets, protection registers and ECC/bad-block management capabilities to support firmware, code storage and data retention use cases in 3V embedded systems.
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