W25N512GVBIT TR

IC FLASH 512MBIT SPI 24TFBGA
Part Description

IC FLASH 512MBIT SPI 24TFBGA

Quantity 506 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package24-TFBGA (6x8)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 MbitAccess Time6 nsGradeIndustrial
Clock Frequency166 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page700 μsPackaging24-TBGA
Mounting MethodNon-VolatileMemory InterfaceSPI - Quad I/OMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of W25N512GVBIT TR – IC FLASH 512MBIT SPI 24TFBGA

The W25N512GVBIT TR is a 3.0V, 512 M-bit serial SLC NAND flash memory device from Winbond Electronics featuring Dual/Quad SPI operation. It implements buffer read and continuous read modes and a 64M × 8 memory organization to deliver high-density non-volatile storage in a compact BGA package.

Designed for systems that require serial SLC NAND storage with high-speed SPI I/O, the device combines a 166 MHz clock capability, Quad I/O interface, and a small 24-TFBGA (6×8) footprint with an extended operating temperature range of −40°C to 85°C.

Key Features

  • Memory Technology Serial SLC NAND flash memory, 512 Mbit capacity organized as 64M × 8 for high-density non-volatile storage.
  • Serial Interface Supports Standard, Dual and Quad SPI instructions and Quad I/O memory interface for accelerated data transfer.
  • High-Speed Read Modes Buffer Read and Continuous Read modes are supported to optimize throughput; device clock frequency specified up to 166 MHz.
  • Performance Metrics Access time noted at 6 ns and typical write/program cycle time for a word/page of 700 µs.
  • Voltage and Temperature Single-supply operation from 2.7 V to 3.6 V with an operating ambient temperature range of −40°C to 85°C (TA).
  • Protection and Management On-device protection and configuration registers, status registers including ECC status and bad block management features as documented in the instruction set.
  • Package Compact 24-TFBGA (6×8 mm, 5×5 ball array) package case for space-constrained designs.

Typical Applications

  • Firmware and Code Storage Non-volatile storage for firmware images and code, leveraging Quad SPI reads and buffer/continuous read modes to accelerate code fetch.
  • Embedded Data Logging High-density SLC NAND capacity supports system data logging and local non-volatile storage in embedded devices.
  • Consumer and Portable Electronics Compact 24-TFBGA footprint and single 2.7–3.6 V supply make the device suitable for space- and power-constrained consumer modules.
  • Industrial Embedded Systems Extended operating temperature range (−40°C to 85°C) supports deployment in industrial environments requiring reliable non-volatile memory.

Unique Advantages

  • High-capacity SLC NAND: 512 Mbit SLC NAND provides a balance of density and NAND-type characteristics in a single-chip solution.
  • High-speed Quad SPI access: Quad I/O support and up to 166 MHz clock capability enable faster serial data transfers compared with single-bit SPI modes.
  • Optimized read modes: Buffer read and continuous read modes reduce latency and improve sustained throughput for sequential access patterns.
  • Robust on-chip management: Built-in protection/configuration and status registers, ECC status reporting and bad block management commands simplify integration and reliability monitoring.
  • Compact BGA package: 24-TFBGA (6×8) package minimizes board area while providing the required I/O density for Quad SPI operation.
  • Wide supply and temperature window: 2.7 V–3.6 V supply range and −40°C to 85°C operating temperature support diverse system power and thermal requirements.

Why Choose W25N512GVBIT TR?

The W25N512GVBIT TR positions itself as a high-density serial SLC NAND flash option with flexible SPI interface modes, on-chip management features and compact packaging. Its combination of 512 Mbit capacity, Dual/Quad SPI support, buffer/continuous read modes and extended temperature rating make it suitable for embedded designs needing reliable non-volatile storage with accelerated serial access.

Engineers selecting this device benefit from documented instruction sets and status/management registers that support bad-block handling, ECC reporting and program/erase control, enabling straightforward integration into embedded firmware and storage architectures.

Request a quote or submit a product inquiry to receive pricing and lead-time information for the W25N512GVBIT TR.

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