W25N512GVBIT TR
| Part Description |
IC FLASH 512MBIT SPI 24TFBGA |
|---|---|
| Quantity | 506 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 24-TFBGA (6x8) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 6 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 700 μs | Packaging | 24-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Quad I/O | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of W25N512GVBIT TR – IC FLASH 512MBIT SPI 24TFBGA
The W25N512GVBIT TR is a 3.0V, 512 M-bit serial SLC NAND flash memory device from Winbond Electronics featuring Dual/Quad SPI operation. It implements buffer read and continuous read modes and a 64M × 8 memory organization to deliver high-density non-volatile storage in a compact BGA package.
Designed for systems that require serial SLC NAND storage with high-speed SPI I/O, the device combines a 166 MHz clock capability, Quad I/O interface, and a small 24-TFBGA (6×8) footprint with an extended operating temperature range of −40°C to 85°C.
Key Features
- Memory Technology Serial SLC NAND flash memory, 512 Mbit capacity organized as 64M × 8 for high-density non-volatile storage.
- Serial Interface Supports Standard, Dual and Quad SPI instructions and Quad I/O memory interface for accelerated data transfer.
- High-Speed Read Modes Buffer Read and Continuous Read modes are supported to optimize throughput; device clock frequency specified up to 166 MHz.
- Performance Metrics Access time noted at 6 ns and typical write/program cycle time for a word/page of 700 µs.
- Voltage and Temperature Single-supply operation from 2.7 V to 3.6 V with an operating ambient temperature range of −40°C to 85°C (TA).
- Protection and Management On-device protection and configuration registers, status registers including ECC status and bad block management features as documented in the instruction set.
- Package Compact 24-TFBGA (6×8 mm, 5×5 ball array) package case for space-constrained designs.
Typical Applications
- Firmware and Code Storage Non-volatile storage for firmware images and code, leveraging Quad SPI reads and buffer/continuous read modes to accelerate code fetch.
- Embedded Data Logging High-density SLC NAND capacity supports system data logging and local non-volatile storage in embedded devices.
- Consumer and Portable Electronics Compact 24-TFBGA footprint and single 2.7–3.6 V supply make the device suitable for space- and power-constrained consumer modules.
- Industrial Embedded Systems Extended operating temperature range (−40°C to 85°C) supports deployment in industrial environments requiring reliable non-volatile memory.
Unique Advantages
- High-capacity SLC NAND: 512 Mbit SLC NAND provides a balance of density and NAND-type characteristics in a single-chip solution.
- High-speed Quad SPI access: Quad I/O support and up to 166 MHz clock capability enable faster serial data transfers compared with single-bit SPI modes.
- Optimized read modes: Buffer read and continuous read modes reduce latency and improve sustained throughput for sequential access patterns.
- Robust on-chip management: Built-in protection/configuration and status registers, ECC status reporting and bad block management commands simplify integration and reliability monitoring.
- Compact BGA package: 24-TFBGA (6×8) package minimizes board area while providing the required I/O density for Quad SPI operation.
- Wide supply and temperature window: 2.7 V–3.6 V supply range and −40°C to 85°C operating temperature support diverse system power and thermal requirements.
Why Choose W25N512GVBIT TR?
The W25N512GVBIT TR positions itself as a high-density serial SLC NAND flash option with flexible SPI interface modes, on-chip management features and compact packaging. Its combination of 512 Mbit capacity, Dual/Quad SPI support, buffer/continuous read modes and extended temperature rating make it suitable for embedded designs needing reliable non-volatile storage with accelerated serial access.
Engineers selecting this device benefit from documented instruction sets and status/management registers that support bad-block handling, ECC reporting and program/erase control, enabling straightforward integration into embedded firmware and storage architectures.
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