| N/A | | WP81348M0828 | Intel | IC MPU IOP348 667MHZ 1357FCBGA | Microprocessors | 1357-FCBGA (37.5x37.5) | N/A | 100°C (TC) | Core Processor: Intel® IOP348 I/O Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 100°C (TC) Mounting Type: Surface Mount Package / Case: 1357-BGA, FCBGA Supplier Device Package: 1357-FCBGA (37.5×37.5) | 1,632 | |
| N/A | | WPIXP2350ACT | Intel | WESTPORT NETWORK PROCESSOR | Microprocessors | 1752-FCBGA (42.5x42.5) | N/A | 0 °C – 105 °C | Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Co-Processors/DSP: Microengine SATA: Gigabit Ethernet (2) | 1,430 | |
| N/A | | WPIXP2350ADT | Intel | IXP -WESTPORT NETWORK PROCESSOR | Microprocessors | 1752-FCBGA (42.5x42.5) | N/A | 0 °C – 105 °C | Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Co-Processors/DSP: Microengine SATA: Gigabit Ethernet (2) | 720 | |
 | | X4MF03107SPZQQ1 | Texas Instruments | IC MCU 16/32B 320KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, LINbus, MibSPI, SCI, UART/USART Program Memory Size: 320KB (320K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 92 | |
 | | X4MF04207SPZQQ1 | Texas Instruments | IC MCU 16/32B 448KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, LINbus, MibSPI, SCI, UART/USART Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 965 | |
 | N/A | X5LS20216ASZWTQQ1 | Texas Instruments | IC MCU 16/32B 2MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,268 | |
 | N/A | X5LS20216SPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 20x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 666 | |
 | N/A | XA1243FPBGABL | Texas Instruments | IC RF TXRX+MCU 161LFBGA | RF Transceiver ICs | 161-FC/CSP (10.4x10.4) | 1.71V ~ 1.89V, 3.15V ~ 3.45V | -40°C ~ 125°C (TJ) | Serial Interfaces: SPI, UART Voltage – Supply: 1.71V ~ 1.89V, 3.15V ~ 3.45V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 161-LFBGA, FCBGA Supplier Device Package: 161-FC/CSP (10.4×10.4) | 915 | |
 | N/A | XA2S100E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 2700 | 653 | |
 | N/A | XA2S100E-6TQ144I | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 1,099 | |
 | N/A | XA2S100E-6TQ144Q | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 2700 | 100 | |
 | N/A | XA2S150E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 3888 | 811 | |
 | N/A | XA2S150E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 3888 | 26 | |
 | N/A | XA2S200E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 701 | |
 | N/A | XA2S200E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 5292 | 1,089 | |
 | N/A | XA2S300E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 790 | |
 | N/A | XA2S300E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 6912 | 528 | |
 | N/A | XA2S50E-6TQ144I | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 1728 | 1,118 | |
 | N/A | XA2S50E-6TQ144Q | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 1728 | 772 | |
 | | XA3S1000-4FGG456I | Advanced Micro Devices | IC FPGA 333 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 17280 | 1,200 | |