UCM1K680MNS1GS

The UCM1K680MNS1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a compact surface‑mount can. It provides 68 µF rated capacitance at 80 V with a wide operating temperature range of −55°C to 105°C and AEC‑Q200 qualification for demanding environments.

Designed for automated assembly, this φ8×10 SMD capacitor combines measurable low loss (tanδ) and controlled leakage with vibration resistance and embossed carrier taping for pick‑and‑place processes—making it suitable for automotive and other harsh‑environment electronic modules.

Key Features

• Core Electrical — 68 µF nominal capacitance with a tolerance of −20% to +20% at 120 Hz, 20°C; rated voltage 80 V.
• Low Loss Performance — tanδ (DF) 0.08 measured at 20°C, 120 Hz (80 V rating), enabling predictable AC behavior in low‑impedance designs.
• Leakage Current — Specified leakage current of 54.4 µA (measured condition as provided), suitable for designs that require defined DC leakage levels.
• Ripple Handling — Low‑frequency ripple current 150 mA at 120 Hz and high‑frequency ripple current 300 mA at 10 kHz, supporting both mains‑adjacent and higher‑frequency applications.
• Reliability & Endurance — Rated life/ endurance of 2000 hours at 105°C (φD ≤ 10); AEC‑Q200 qualification indicated for automotive‑grade reliability.
• Temperature & Robustness — Operating range −55°C to 105°C with vibration‑resistant construction for mechanically demanding environments.
• Package & Mounting — Chip‑type radial can (SMD) in φ8×10L format with surface‑mount land size 8.3 × 8.3 mm; supplied in embossed carrier taping for automated placement.
• Compliance — RoHS compliant as specified in product data.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualified component for automotive electronic modules operating across −55°C to 105°C where 80 V rated capacitance is required.
• Surface‑Mount Power Modules — Compact φ8×10 SMD form factor and embossed carrier taping for automated assembly into board‑level power subsystems.
• Harsh‑Environment Electronics — Vibration‑resistant construction and 2000 h endurance at 105°C for electronics exposed to elevated temperatures and mechanical stress.

Unique Advantages

• High Voltage Capability: 80 V rating provides headroom for higher‑voltage board designs where elevated DC voltage handling is required.
• Measured Low Loss: tanδ of 0.08 at 120 Hz (20°C) enables predictable impedance behavior in AC and ripple conditions.
• Defined Leakage Performance: Specified leakage current (54.4 µA) allows designers to account for DC loss in power budgets and bias networks.
• Automated Assembly Ready: Embossed carrier taping and SMD can package streamline placement and reduce handling for high‑volume production.
• Automotive‑Grade Reliability: AEC‑Q200 qualification combined with 2000 h endurance at 105°C supports use in stringent reliability programs.
• Compact Footprint: φ8×10L size with defined surface‑mount land dimensions (8.3 × 8.3 mm) simplifies board layout in space‑constrained designs.

Why Choose UCM1K680MNS1GS?

The UCM1K680MNS1GS delivers a balanced combination of high‑voltage capacitance, low loss, and defined leakage in a vibration‑resistant, surface‑mount chip can optimized for automated assembly. Its AEC‑Q200 qualification and 2000‑hour endurance at 105°C make it a suitable choice for engineers targeting reliable performance in automotive and other harsh‑environment electronic modules.

Choose this part when you need a compact SMD aluminum electrolytic with clear electrical parameters (68 µF, 80 V, tanδ 0.08), controlled ripple capability, and supply‑chain friendly packaging for volume production.

Request a quote or contact sales to discuss availability, lead times, and sample requests for UCM1K680MNS1GS.