UCM1V101MCL1GS

The UCM1V101MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor from Nichicon's UCM series. It delivers 100 µF capacitance at a 35 V rating in a compact surface-mount can (φ6.3 × 5.8 mm) optimized for automated assembly.

Designed for temperature-demanding and qualification-driven applications, this part combines low impedance, controlled leakage, and defined ripple-current capability with AEC-Q200 qualification and a wide operating range from −55°C to 105°C.

Key Features

• Electrical Performance 100 µF nominal capacitance with ±20% tolerance and a rated voltage of 35 V. Rated impedance is 260 mΩ and tan δ (DF) is specified at a maximum of 0.12 at 120 Hz, 20°C for the 35 V rating.
• Ripple and Leakage Low-frequency ripple current is specified at 150 mA (120 Hz) and high-frequency ripple current at 300 mA (10 kHz). Leakage current is specified at 35 µA.
• Thermal and Endurance Operating temperature range from −55°C to 105°C with a rated life (endurance) of 2000 hours at 105°C for this package size.
• Qualification and Reliability AEC-Q200 rated per product data and manufactured to meet endurance and shelf-life requirements outlined in the series datasheet.
• Compact SMD Package Chip-type aluminum can in a φ6.3 × 5.8 mm package case suitable for surface-mount placement; recommended land size 6.6 × 6.6 mm.
• Assembly-Friendly Packaging Supplied in embossed carrier taping for automatic mounting machines to support high-volume surface-mount assembly.
• Polarized Polarized aluminum electrolytic construction for DC applications that require electrolytic capacitance characteristics.

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC-Q200 qualification and wide temperature range (−55°C to 105°C) are required.
• Surface-Mount Power Modules — Compact SMD can with low impedance and defined ripple-current ratings makes it suitable for local decoupling and filtering in power stages.
• Automated PCB Assembly — Embossed carrier taping and chip-type form factor streamline pick-and-place and reflow processes for high-volume manufacturing.

Unique Advantages

• Low-Impedance Performance: 260 mΩ impedance and a measured tan δ of 0.12 at 35 V (120 Hz, 20°C) help reduce voltage ripple and improve transient response in compact layouts.
• Defined Ripple Handling: Specified ripple-current ratings (150 mA at 120 Hz, 300 mA at 10 kHz) enable designers to size capacitors against expected AC stress with clarity.
• High-Temperature Endurance: Rated for 2000 hours at 105°C for the package size, supporting applications that operate in elevated-temperature environments.
• AEC-Q200 Qualification: Qualification per AEC-Q200 and explicit automotive application listing in the product data support use where automotive reliability expectations apply.
• Compact Footprint for SMD Designs: Small φ6.3 × 5.8 mm can and 6.6 × 6.6 mm recommended land save board area while retaining meaningful capacitance and voltage rating.
• Assembly-Ready Packaging: Embossed carrier taping facilitates automated placement to reduce handling time and support volume production.

Why Choose UCM1V101MCL1GS?

The UCM1V101MCL1GS positions itself as a reliable, compact SMD aluminum electrolytic solution where low impedance, controlled leakage, and elevated-temperature operation are required. With AEC-Q200 qualification, 2000-hour endurance at 105°C, and assembly-friendly embossed tape packaging, it addresses design needs for automotive and other temperature-demanding applications that require verified electrical and mechanical characteristics.

This part is suitable for engineers and procurement teams specifying capacitors for small-footprint power modules, automotive electronic control units, or any surface-mount assemblies that need a balance of capacitance, voltage rating, ripple capability, and long-term durability.

Request a quote or contact sales to discuss availability, pricing, and sample quantities for UCM1V101MCL1GS.