UCN1E471MCL1GS
| Part Description |
470 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,841 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCN |
| Manufacturer | Nichicon |
| Manufacturing Status | New Item |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 470 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 300 mOhm @ 100 kHz | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 3000 h @ 125°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 125°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 270 mA @ 10 kHz | Ripple Current Low Frequency | 135 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 25 V |
Overview of UCN1E471MCL1GS – 470 µF, 25 V Surface‑Mount Aluminum Electrolytic Capacitor (AEC‑Q200)
The UCN1E471MCL1GS is a surface‑mount aluminum electrolytic chip capacitor in the Nichicon UCN series designed for high‑reliability, high‑temperature applications. It provides 470 µF capacitance at 25 V in a compact φ8×10 mm can (chip type) with embossed carrier taping for automated assembly.
Engineered for demanding environments, this part combines a wide operating temperature range (−40 °C to 125 °C), AEC‑Q200 qualification, and long endurance (3000 hours at 125 °C), making it suitable for applications that require stable bulk capacitance and controlled loss over time.
Key Features
- Capacitance & Voltage — 470 µF nominal capacitance with ±20% tolerance, rated for 25 V operation.
- High Temperature Endurance — Rated life of 3000 hours at 125 °C; after endurance test the capacitor meets specified limits for capacitance change, tan δ, and leakage current.
- Low Loss Characteristics — tan δ (DF) max 0.18 measured at 20 °C, 120 Hz, supporting reliable energy storage with controlled dissipation.
- Measured ESR — Equivalent series resistance of 300 mΩ at 20 °C/100 kHz, supporting effective ripple performance at higher frequencies.
- Ripple Current Capability — Rated ripple current of 135 mA at 120 Hz and 270 mA at 10 kHz, enabling use in filtering and decoupling across frequency ranges.
- Leakage Current — Specified leakage current 117.5 µA (per product data), with datasheet limits consistent with standard rated‑voltage conditioning methods.
- Automated Assembly Ready — Chip‑type can in embossed carrier taping format suitable for automatic mounting processes; surface‑mount package case φ8×10 mm with recommended land size L: 8.3 × W: 8.3 mm.
- Compliance — RoHS compliant and AEC‑Q200 qualified for applications requiring industry reliability standards.
Typical Applications
- Automotive Electronics — Bulk energy storage and decoupling in control modules and electronics where AEC‑Q200 qualification and extended high‑temperature operation are required.
- Power Supply Filtering — Bulk smoothing and ripple suppression in DC‑DC converters and power rails, leveraging the part’s ripple current ratings and measured ESR.
- Automated Surface‑Mount Production — Designed for pick‑and‑place with embossed carrier taping to streamline high‑volume PCB assembly.
Unique Advantages
- High‑temperature reliability: 3000 hours endurance at 125 °C delivers predictable lifetime performance for elevated ambient designs.
- AEC‑Q200 qualification: Supports designs that require supplier assurance for components used in demanding or safety‑critical systems.
- Frequency‑aware ripple performance: Specified ripple current values at both 120 Hz and 10 kHz plus 300 mΩ ESR at 100 kHz enable effective noise suppression across low and high frequencies.
- Assembly efficiency: Embossed carrier taping and chip‑type SMD can form factor simplify placement and reduce handling time on automated lines.
- Compact footprint: φ8×10 mm package with defined land pattern (8.3 × 8.3 mm) provides a high capacitance density for space‑constrained boards.
Why Choose UCN1E471MCL1GS?
The UCN1E471MCL1GS balances high capacitance and verified high‑temperature endurance in a compact surface‑mount chip can, backed by AEC‑Q200 qualification and RoHS compliance. Its measured ESR, frequency‑rated ripple currents, and controlled dissipation (tan δ) make it a practical choice for engineers specifying bulk capacitance and filtering where long‑term stability at elevated temperatures is critical.
This part is well suited to teams designing automotive electronics, power subsystems, and other high‑reliability applications that require automated assembly compatibility and documented endurance characteristics from the component vendor.
Request a quote or contact sales to discuss volume pricing, lead times, or sample availability for UCN1E471MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016